Re: [PATCH V6 1/2] Thermal: Add ST-Ericsson DB8500 thermal driver.

2012-11-18 Thread Zhang Rui
On Sun, 2012-11-18 at 15:29 +0100, Francesco Lavra wrote: > On 11/15/2012 01:51 PM, Zhang Rui wrote: > > On Thu, 2012-11-15 at 18:56 +0800, hongbo.zhang wrote: > >> From: "hongbo.zhang" > >> > >> This driver is based on the thermal management framewo

Re: [PATCH V6 2/2] Thermal: Add ST-Ericsson DB8500 thermal properties and platform data.

2012-11-15 Thread Zhang Rui
On Thu, 2012-11-15 at 18:56 +0800, hongbo.zhang wrote: > From: "hongbo.zhang" > > This patch adds device tree properties for ST-Ericsson DB8500 thermal driver, > also adds the platform data to support the old fashion. > > Signed-off-by: hongbo.zhang > Reviewed-by: Viresh Kumar > Acked-by: Linu

Re: [PATCH V6 1/2] Thermal: Add ST-Ericsson DB8500 thermal driver.

2012-11-15 Thread Zhang Rui
is clipped down to cool the CPU, and other cooling devices can be added and bound to the trip points dynamically. The platform specific PRCMU interrupts are used to active thermal update when trip points are reached. Signed-off-by: hongbo.zhang Reviewed-by: Viresh Kumar Reviewed-by: Francesco La

Re: [PATCH V5 1/2] Thermal: Add ST-Ericsson DB8500 thermal driver.

2012-11-15 Thread Zhang Rui
On Thu, 2012-11-15 at 16:32 +0800, Hongbo Zhang wrote: > On 15 November 2012 16:13, Zhang Rui wrote: > > On Fri, 2012-11-09 at 19:29 +0800, hongbo.zhang wrote: > >> From: "hongbo.zhang" > >> > >> This driver is based on the thermal management framewo

Re: [PATCH V5 1/2] Thermal: Add ST-Ericsson DB8500 thermal driver.

2012-11-15 Thread Zhang Rui
On Fri, 2012-11-09 at 19:29 +0800, hongbo.zhang wrote: > From: "hongbo.zhang" > > This driver is based on the thermal management framework in thermal_sys.c. A > thermal zone device is created with the trip points to which cooling devices > can be bound, the current cooling device is cpufreq, e.g.

Re: [PATCH V5 2/2] Thermal: Add ST-Ericsson DB8500 thermal properties and platform data.

2012-11-11 Thread Zhang Rui
On Fri, 2012-11-09 at 19:29 +0800, hongbo.zhang wrote: > From: "hongbo.zhang" > > This patch adds device tree properties for ST-Ericsson DB8500 thermal driver, > also adds the platform data to support the old fashion. > > Signed-off-by: hongbo.zhang > Reviewed-by: Viresh Kumar hmmm, who shou

Re: [PATCH V3 3/5] Thermal: Remove the cooling_cpufreq_list.

2012-11-06 Thread Zhang Rui
On Tue, 2012-10-30 at 17:48 +0100, hongbo.zhang wrote: > From: "hongbo.zhang" > > Problem of using this list is that the cpufreq_get_max_state callback will be > called when register cooling device by thermal_cooling_device_register, but > this list isn't ready at this moment. What's more, there

Re: [PATCH V3 2/5] Thermal: fix bug of counting cpu frequencies.

2012-11-06 Thread Zhang Rui
On Tue, 2012-10-30 at 17:48 +0100, hongbo.zhang wrote: > From: "hongbo.zhang" > > In the while loop for counting cpu frequencies, if table[i].frequency equals > CPUFREQ_ENTRY_INVALID, index i won't be increased, so this leads to an endless > loop, what's more the index i cannot be referred as cpu

Re: [PATCH V3 1/5] Thermal: add indent for code alignment.

2012-11-06 Thread Zhang Rui
On Tue, 2012-10-30 at 17:48 +0100, hongbo.zhang wrote: > From: "hongbo.zhang" > > The curly bracket should be aligned with corresponding if else statements. > > Signed-off-by: hongbo.zhang > Reviewed-by: Viresh Kumar applied to thermal-next. thanks, rui > --- > drivers/thermal/cpu_cooling.

RE: [PATCH V3 4/5] Thermal: Add ST-Ericsson DB8500 thermal driver.

2012-10-31 Thread Zhang, Rui
> -Original Message- > From: hongbo.zhang [mailto:hongbo.zh...@linaro.org] > Sent: Wednesday, October 31, 2012 12:49 AM > To: linaro-dev@lists.linaro.org; linux-ker...@vger.kernel.org; linux- > p...@vger.kernel.org; Zhang, Rui; amit.kach...@linaro.org > Cc: patc...@lina

Re: [PATCH 0/2] Thermal patches to deactive cooling devices when needed

2012-09-21 Thread Zhang Rui
On 五, 2012-09-21 at 15:50 +0800, Hongbo Zhang wrote: > On 21 September 2012 15:21, Zhang Rui wrote: > > On 五, 2012-09-21 at 14:57 +0800, zhanghongbo wrote: > >> From: "hongbo.zhang" > >> > >> This patch set contains two patches. > >>

Re: [PATCH 0/2] Thermal patches to deactive cooling devices when needed

2012-09-21 Thread Zhang Rui
On 五, 2012-09-21 at 14:57 +0800, zhanghongbo wrote: > From: "hongbo.zhang" > > This patch set contains two patches. > > [PATCH 1/2] > A new interface is introduced to deactive all the referenced cooling devices > when thermal zone is disabled. we can not deactive a cooling device directly. we s

RE: [PATCH v3 0/6] thermal: exynos: Add kernel thermal support for exynos platform

2012-05-08 Thread Zhang, Rui
, May 08, 2012 9:18 AM To: a...@linux-foundation.org; linux...@lists.linux-foundation.org Cc: R, Durgadoss; linux-a...@vger.kernel.org; l...@kernel.org; Zhang, Rui; amit.kach...@linaro.org; linaro-dev@lists.linaro.org; linux-ker...@vger.kernel.org; linux-arm-ker...@lists.infradead.org; linux-samsung-...

Re: [PATCH V2 0/6] thermal: exynos: Add kernel thermal support for exynos platform

2012-04-15 Thread Zhang Rui
On 三, 2012-04-11 at 18:17 +0530, Amit Kachhap wrote: > Hi Rui, > > Thanks for looking into the patches. > > On 10 April 2012 06:28, Zhang Rui wrote: > > Hi, Amit, > > > > On 三, 2012-04-04 at 10:02 +0530, Amit Kachhap wrote: > >> Hi Len/Rui, > >>

Re: [PATCH V2 0/6] thermal: exynos: Add kernel thermal support for exynos platform

2012-04-09 Thread Zhang Rui
Hi, Amit, On 三, 2012-04-04 at 10:02 +0530, Amit Kachhap wrote: > Hi Len/Rui, > > Any comment or feedback from your side about the status of this patch? > Is it merge-able or major re-work is needed? I have fixed most of the > comments in this patchset and currently working on some of the minor >

Re: [RFC PATCH 0/2] thermal: Add generic cpu cooling devices according to thermal framework

2012-02-03 Thread Zhang Rui
Hi, sorry for the late response. On 四, 2012-01-19 at 14:47 +0530, Amit Kachhap wrote: > On 13 December 2011 20:43, Amit Daniel Kachhap > wrote: > > PATCH 1) [thermal: Add a new trip type to use cooling device instance > > number] > > This patch adds a new trip type THERMAL_TRIP_STATE_ACTIVE wh