On Sun, 2012-11-18 at 15:29 +0100, Francesco Lavra wrote: > On 11/15/2012 01:51 PM, Zhang Rui wrote: > > On Thu, 2012-11-15 at 18:56 +0800, hongbo.zhang wrote: > >> From: "hongbo.zhang" <hongbo.zh...@linaro.com> > >> > >> This driver is based on the thermal management framework in thermal_sys.c. > >> A > >> thermal zone device is created with the trip points to which cooling > >> devices > >> can be bound, the current cooling device is cpufreq, e.g. CPU frequency is > >> clipped down to cool the CPU, and other cooling devices can be added and > >> bound > >> to the trip points dynamically. The platform specific PRCMU interrupts are > >> used to active thermal update when trip points are reached. > >> > >> Signed-off-by: hongbo.zhang <hongbo.zh...@linaro.com> > >> Reviewed-by: Viresh Kumar <viresh.ku...@linaro.org> > >> Reviewed-by: Francesco Lavra <francescolavra...@gmail.com> > > > > Patch is refreshed and applied to thermal next. > > refreshed patch attached. > [...] > > diff --git a/drivers/thermal/Kconfig b/drivers/thermal/Kconfig > > index 99b6587..d96da07 100644 > > --- a/drivers/thermal/Kconfig > > +++ b/drivers/thermal/Kconfig > > @@ -101,5 +101,25 @@ config EXYNOS_THERMAL > > If you say yes here you get support for TMU (Thermal Managment > > Unit) on SAMSUNG EXYNOS series of SoC. > > > > +config DB8500_THERMAL > > + bool "DB8500 thermal management" > > + depends on ARCH_U8500 > > Shouldn't it depend on THERMAL as well, as in Hongbo's original patch? > all of these options are available only if CONFIG_THERMAL is set. please refer to commit 72e198978223f2020f7f59a6e2520f2b7d005e72 in the thermal next tree.
thanks, rui > > + default y > > + help > > + Adds DB8500 thermal management implementation according to the thermal > > + management framework. A thermal zone with several trip points will be > > + created. Cooling devices can be bound to the trip points to cool this > > + thermal zone if trip points reached. > > + > > +config DB8500_CPUFREQ_COOLING > > + tristate "DB8500 cpufreq cooling" > > + depends on ARCH_U8500 > > + depends on CPU_THERMAL > > + default y > > + help > > + Adds DB8500 cpufreq cooling devices, and these cooling devices can be > > + bound to thermal zone trip points. When a trip point reached, the > > + bound cpufreq cooling device turns active to set CPU frequency low to > > + cool down the CPU. > > > > endif > > -- > Francesco _______________________________________________ linaro-dev mailing list linaro-dev@lists.linaro.org http://lists.linaro.org/mailman/listinfo/linaro-dev
