在 2022/12/14 17:55, humin (Q) 写道:
Acked-by：Min Hu (Connor) <humi...@huawei.com>
Indeed, it is better to move them to bonding PMD. lgtm
Series-acked-by: Huisong Li <lihuis...@huawei.com>
在 2022/12/14 14:13, Chengwen Feng 写道:
This patchset adds device private dump for bonding PMD, and use
rte_eth_dev_priv_dump API to implement testpmd show bonding command.
Chengwen Feng (3):
net/bonding: support private dump ops
net/bonding: support dump LACP info
net/bonding: use dump API to impl show bonding cmd
---
v2:
* address Min Hu's comment
* use rte_eth_dev_priv_dump API to implement testpmd show bonding
command.
.../link_bonding_poll_mode_drv_lib.rst | 13 +-
drivers/net/bonding/bonding_testpmd.c | 281 +-----------------
drivers/net/bonding/rte_eth_bond_pmd.c | 244 ++++++++++++++-
3 files changed, 249 insertions(+), 289 deletions(-)
.
