On 12/15/2022 10:56 AM, lihuisong (C) wrote: > > 在 2022/12/14 17:55, humin (Q) 写道:
>> >> 在 2022/12/14 14:13, Chengwen Feng 写道: >>> This patchset adds device private dump for bonding PMD, and use >>> rte_eth_dev_priv_dump API to implement testpmd show bonding command. >>> >>> Chengwen Feng (3): >>> net/bonding: support private dump ops >>> net/bonding: support dump LACP info >>> net/bonding: use dump API to impl show bonding cmd >>> >>> --- >>> v2: >>> * address Min Hu's comment >>> * use rte_eth_dev_priv_dump API to implement testpmd show bonding >>> command. >>> >>> .../link_bonding_poll_mode_drv_lib.rst | 13 +- >>> drivers/net/bonding/bonding_testpmd.c | 281 +----------------- >>> drivers/net/bonding/rte_eth_bond_pmd.c | 244 ++++++++++++++- >>> 3 files changed, 249 insertions(+), 289 deletions(-) >>> >> Acked-by：Min Hu (Connor) <humi...@huawei.com> > > Indeed, it is better to move them to bonding PMD. lgtm > Series-acked-by: Huisong Li <lihuis...@huawei.com> +1 to move code to bonding PMD & merge LACP info withing show bonding config command and remove the redundant one from bonding testpmd, For series, Acked-by: Ferruh Yigit <ferruh.yi...@amd.com> Series applied to dpdk-next-net/main, thanks.
