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**************************************************************************************** * CALL FOR PAPERS * * * * ICNC 2023 * * The International Conference on Computing, Networking and Communications * * * * February 20-22, 2023, Honolulu, Hawaii, USA * * http://www.conf-icnc.org/2023 * * * **************************************************************************************** Sponsored by the Technology Innovation Association Paper submission deadline: October 15, 2022 OVERVIEW: The International Conference on Computing, Networking and Communications (ICNC), sponsored by the Technology Innovation Association, is a premier conference in the computer and communication fields. ICNC 2023 will be held in Honolulu, Hawaii, USA, during February 20-22, 2023. Perspective authors are cordially invited to submit original technical papers to the following areas: * AI and Machine Learning for Communications and Networking * Communications and Information Security * Edge Computing, Cloud Computing, and Big Data * Mobile and Wireless Networking * Multimedia Computing and Communications * Next Generation Networks and Internet Applications * Network Algorithms and Performance Evaluations * Optical and Grid Networking * Signal Processing for Communications * Social Computing and Data Mining * Wireless Ad Hoc and Sensor Networks * Wireless Communications PAPER SUBMISSION: Papers should be submitted via EDAS. Please visit the conference website at http://www.conf-icnc.org/2023 for instructions. IMPORTANT DATES: Submission deadline (firm): October 15, 2022 (extended) Acceptance notification: November 15, 2022 Camera-ready paper: November 30, 2022 Conference date: February 20-22, 2023 CONFERENCE ORGANIZING COMMITTEE General Chair: Hussein T. Mouftah, Ottawa University, Canada. Cheng Li, Memorial University, Canada TPC Chair: Jun Zheng, Southeast University, China TPC Co-Chairs: Douglas Blough, Georgia Institute of Technology, USA Pascal Lorenz, University of Haute Alsace, France Xianbin Wang, Western University, Canada Executive Co-Chairs: Jian Ren, Michigan State University, USA Tomohiko Taniguchi, Fujitsu, Japan Invited Talk Co-Chairs: Shiwen Mao, Auburn University, USA Tony Quek, Singapore University of Technology and Design, Singapore Tutorial Co-Chairs: Roberto Rojas-Cessa, New Jersey Institute of Technology, USA Yan Zhang, University of Oslo, Norway Workshop Co-Chairs: Stefano Giordano, University of Pisa, Italy Song Guo, The Hong Kong Polytechnic University, China Publicity Co-Chairs: Xiang Gui, Massey University, New Zealand Nathalie Mitton, INRIA, France Hidekazu Murata, Yamaguchi University, Japan _______________________________________________ uai mailing list uai@engr.orst.edu https://it.engineering.oregonstate.edu/mailman/listinfo/uai