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     *                                                         CALL FOR PAPERS  
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     *                                                               ICNC 2023  
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     *     The International Conference on Computing, Networking and 
Communications     *
     *                                                                          
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     *                                 February 20-22, 2023, Honolulu, Hawaii, 
USA                                  *
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http://www.conf-icnc.org/2023                                            *
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                              Sponsored by the Technology Innovation Association

                                       Paper submission deadline: October 15, 
2022

OVERVIEW: 
The International Conference on Computing, Networking and Communications 
(ICNC), sponsored by the Technology Innovation Association, is a premier 
conference in the computer and communication fields. ICNC 2023 will be held in 
Honolulu, Hawaii, USA, during February 20-22, 2023. Perspective authors are 
cordially invited to submit original technical papers to the following areas:
  *   AI and Machine Learning for Communications and Networking
  *   Communications and Information Security
  *   Edge Computing, Cloud Computing, and Big Data
  *   Mobile and Wireless Networking
  *   Multimedia Computing and Communications
  *   Next Generation Networks and Internet Applications
  *   Network Algorithms and Performance Evaluations
  *   Optical and Grid Networking
  *   Signal Processing for Communications
  *   Social Computing and Data Mining
  *   Wireless Ad Hoc and Sensor Networks
  *   Wireless Communications

PAPER SUBMISSION:
Papers should be submitted via EDAS. Please visit the conference website at  
http://www.conf-icnc.org/2023 for instructions. 

IMPORTANT DATES:                
Submission deadline (firm):       October 15, 2022 (extended)
Acceptance notification:            November 15, 2022
Camera-ready paper:                 November 30, 2022
Conference date:                        February 20-22, 2023

CONFERENCE ORGANIZING COMMITTEE
General Chair:
Hussein T. Mouftah, Ottawa University, Canada.
Cheng Li, Memorial University, Canada

TPC Chair:
Jun Zheng, Southeast University, China

TPC Co-Chairs:
Douglas Blough, Georgia Institute of Technology, USA
Pascal Lorenz, University of Haute Alsace, France
Xianbin Wang, Western University, Canada

Executive Co-Chairs:
Jian Ren, Michigan State University, USA
Tomohiko Taniguchi, Fujitsu, Japan

Invited Talk Co-Chairs:
Shiwen Mao, Auburn University, USA
Tony Quek, Singapore University of Technology and Design, Singapore

Tutorial Co-Chairs:
Roberto Rojas-Cessa, New Jersey Institute of Technology, USA
Yan Zhang, University of Oslo, Norway

Workshop Co-Chairs:
Stefano Giordano, University of Pisa, Italy
Song Guo, The Hong Kong Polytechnic University, China

Publicity Co-Chairs:
Xiang Gui, Massey University, New Zealand
Nathalie Mitton, INRIA, France
Hidekazu Murata, Yamaguchi University, Japan
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