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Call for WORK-IN-PROGRESS papers and DEMOs SMARTCOMP 2016 Second IEEE International Conference on Smart Computing http://www.smart-comp.org/ May 18-20, 2016 St. Louis, Missouri, USA ******* WIP/DEMO PAPER SUBMISSION DEADLINE: March 7, 2016 ******* Conference Proceedings in IEEE Xplore ------------------------------------------------------------------------ The 2nd IEEE International Conference on Smart Computing (SMARTCOMP 2016) draws upon many application disciplines such as transportation, energy, environmental protection, resource management, healthcare, security, banking, entertainment, and social media. In addition to full-length technical papers, SMARTCOMP welcomes Work in Progress (WIP) papers and technical demonstrations(DEMOs)showing innovative and original research in the areas of smart computing. Submissions from both industry and academia are strongly encouraged. WIP papers are expected to report on early or ongoing research activities, while DEMO papers are expected to present innovative applications and tools. The WIP and DEMO sessions will provide a forum to discuss novel ideas and emerging results, presenting innovative applications and tools, and bring about novel research questions, approaches, and directions. TOPICS: Submissions should be targeted to one of the following major areas: - Smart Cyber-Physical Environments and Energy/Water/Agriculture/Transportation/Healthcare/Banking Infrastructure - Security, Privacy, and Economics in Smart Environments - Smart Computing Technologies - Future Smart Computing Paradigms - Smart Human Environments, Health, Entertainment, and Social Activities - Smart Energy Management and Analytics SUBMISSION GUIDELINES: WIP and Demo papers may be no more than 3 pages in length, including figures, tables, and references. WIP papers are expected to present early or ongoing research activities. Novel approaches and preliminary results are especially appreciated. Demo papers should explicitly state what will be demonstrated to the audience, and how the attendees will be able to interact, enjoy, and experiment. The submitted manuscripts will be reviewed by members of the SMARTCOMP 2016 Technical Program Committee. All the accepted papers will be presented as posters and included in the conference proceedings. At least one author of each accepted paper must register and attend the conference to present the work. The accepted papers will be published in the conference proceedings by IEEE, and will be included in the Digital Library. Authors are requested to submit original, unpublished manuscripts in standard IEEE proceedings format in PDF. All submissions must be typeset in double-column IEEE format using 10pt fonts on US letter paper, with all fonts embedded. Submitted papers must include the contact information of all the authors. Please make sure you use the latest version of the templates to prepare your submissions. Due to the short interval between the notification of acceptance and the camera-ready deadline, we strongly encourage authors to follow the camera-ready formatting guidelines as close as possible even for the initial abstract submission. The IEEE LaTeX and Microsoft Word templates for conferences can be found at IEEE Manuscript Templates for Conference Proceedings at http://www.ieee.org/conferences_events/conferences/publishing/templates.html Further information for authors may be found at the IEEE Computer Society Information for Authors for Conference Publishing Services: http://www.computer.org/web/cs-cps/authors Submissions must be made via EasyChair: https://easychair.org/conferences/?conf=smartcomp2016 When submitting, please select the appropriate Track for your paper (i.e., WIP or Demo). IMPORTANT DATES: Paper submissions: March 7, 2016 Notification of acceptance: March 30, 2016 Camera-ready copy due: April 15, 2016 Conference date: May 18-20, 2016 WIP/DEMO CO-CHAIRS: Hassan Ghasemzadeh (has...@eecs.wsu.edu), Washington State University, USA Sejun Song (song...@umkc.edu), University of Missouri-Kansas City, USA _______________________________________________ uai mailing list uai@ENGR.ORST.EDU https://secure.engr.oregonstate.edu/mailman/listinfo/uai