On 10/11/2021 9:17 AM, Li, Xiaoyun wrote:
-Original Message-
From: Min Hu (Connor)
Sent: Friday, September 24, 2021 17:57
To: dev@dpdk.org
Cc: Yigit, Ferruh ; Li, Xiaoyun
Subject: [PATCH v3] app/testpmd: add cmdline to show LACP bonding info
From: Chengchang Tang
Add a new cmdline to
> -Original Message-
> From: Min Hu (Connor)
> Sent: Friday, September 24, 2021 17:57
> To: dev@dpdk.org
> Cc: Yigit, Ferruh ; Li, Xiaoyun
> Subject: [PATCH v3] app/testpmd: add cmdline to show LACP bonding info
>
> From: Chengchang Tang
>
> Add a new cmdline to help diagnostic the bon
From: Chengchang Tang
Add a new cmdline to help diagnostic the bonding mode 4 in testpmd.
Show the lacp information about the bonded device and its slaves:
show bonding lacp info
Signed-off-by: Chengchang Tang
Signed-off-by: Min Hu(Connor)
---
v3:
* fix state show.
v2:
* same patch with v1.
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