On 10/11/2021 9:17 AM, Li, Xiaoyun wrote:
-----Original Message-----
From: Min Hu (Connor) <humi...@huawei.com>
Sent: Friday, September 24, 2021 17:57
To: dev@dpdk.org
Cc: Yigit, Ferruh <ferruh.yi...@intel.com>; Li, Xiaoyun <xiaoyun...@intel.com>
Subject: [PATCH v3] app/testpmd: add cmdline to show LACP bonding info
From: Chengchang Tang <tangchengch...@huawei.com>
Add a new cmdline to help diagnostic the bonding mode 4 in testpmd.
Show the lacp information about the bonded device and its slaves:
show bonding lacp info <bonded device port_id>
Signed-off-by: Chengchang Tang <tangchengch...@huawei.com>
Signed-off-by: Min Hu(Connor) <humi...@huawei.com>
---
v3:
* fix state show.
v2:
* same patch with v1.
---
app/test-pmd/cmdline.c | 184 ++++++++++++++++++++
doc/guides/testpmd_app_ug/testpmd_funcs.rst | 6 +
2 files changed, 190 insertions(+)
Acked-by: Xiaoyun Li <xiaoyun...@intel.com>
Applied to dpdk-next-net/main, thanks.
