> -----Original Message----- > From: Min Hu (Connor) <humi...@huawei.com> > Sent: Friday, September 24, 2021 17:57 > To: dev@dpdk.org > Cc: Yigit, Ferruh <ferruh.yi...@intel.com>; Li, Xiaoyun <xiaoyun...@intel.com> > Subject: [PATCH v3] app/testpmd: add cmdline to show LACP bonding info > > From: Chengchang Tang <tangchengch...@huawei.com> > > Add a new cmdline to help diagnostic the bonding mode 4 in testpmd. > > Show the lacp information about the bonded device and its slaves: > show bonding lacp info <bonded device port_id> > > Signed-off-by: Chengchang Tang <tangchengch...@huawei.com> > Signed-off-by: Min Hu(Connor) <humi...@huawei.com> > --- > v3: > * fix state show. > > v2: > * same patch with v1. > --- > app/test-pmd/cmdline.c | 184 ++++++++++++++++++++ > doc/guides/testpmd_app_ug/testpmd_funcs.rst | 6 + > 2 files changed, 190 insertions(+)
Acked-by: Xiaoyun Li <xiaoyun...@intel.com>
