On Thu, 26 Jan 2012 10:21:18 +0100 Lluís Batlle i Rossell <vi...@viric.name> wrote:
> Yes, I noticed that web page, but "450g eCu" frightened me a bit. :) I can't > imagine > what is that. > > If fanless, perfect, of course. But changing a 'fan' looks like much less > effort > at least. Do you have any ideas in more detail, to achieve a fanless fuloong? I believe it could be possible to run fanless with the standard heatsinks. Open the Fuloong, then: - unscrew the heatsinks from the board; - check if thermal compound between the chips and the heatsinks is of good quality and is enough; - then remove it all from both chips and heatsinks anyway :) - spread some high-quality thermal grease[1] onto the chips; - attach heatsinks back into their place; - put the board on a flat non-conducting surface, carefully attach cables and turn it on; - run some high CPU load app (even 'dd if=/dev/zero | sha1sum') for some time, and periodically check if your finger can tolerate the temperature of heatsinks; - if it can't, turn the thing off and get "back to the drawing board"; - if it can, and even after some hours of 100% CPU load, turn it off, then reassemble into the case, but without the fan; - turn it on, run the same app and carefully observe temperature of the outside surface of the case, also any smell of plastics burning/melting or any errors/lockups in the applications. Note: I have not tried the above yet, but you asked for ideas :) [1] http://en.wikipedia.org/wiki/Thermal_grease -- With respect, Roman ~~~~~~~~~~~~~~~~~~~~~~~~~~~ "Stallman had a printer, with code he could not see. So he began to tinker, and set the software free."
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