On 07/02/2018 08:26, Viresh Kumar wrote: > On 06-02-18, 11:48, Daniel Lezcano wrote: >> On 06/02/2018 05:28, Viresh Kumar wrote: > >>> Surely we can do one thing at a time if that's the way we choose to do it. >> >> Easy to say :) >> >> The current code is to introduce the feature without impacting the DT >> bindings in order to keep focused on the thermal mitigation aspect. >> >> There are still a lot of improvements to do after that. You are >> basically asking me to implement the copy-on-write before the memory >> management is complete. > > Perhaps I wasn't clear. What I was trying to say is that we can do "one thing > at > a time" if we choose to create a "combo device" (the way you proposed). I am > not > trying to force you to solve all the problems in one go :)
Oh, ok :) >> Can you give an example? Or your understanding is incorrect or I missed >> the point. > > So I tried to write it down and realized I was assuming that different > cooling-maps can be provided for different cooling strategies > (cpufreq/cpuidle) and obviously that's not the case as its per device. > Not sure if it would be correct to explore the possibility of doing > that. > -- <http://www.linaro.org/> Linaro.org │ Open source software for ARM SoCs Follow Linaro: <http://www.facebook.com/pages/Linaro> Facebook | <http://twitter.com/#!/linaroorg> Twitter | <http://www.linaro.org/linaro-blog/> Blog
