On 06-02-18, 11:48, Daniel Lezcano wrote: > On 06/02/2018 05:28, Viresh Kumar wrote:
> > Surely we can do one thing at a time if that's the way we choose to do it. > > Easy to say :) > > The current code is to introduce the feature without impacting the DT > bindings in order to keep focused on the thermal mitigation aspect. > > There are still a lot of improvements to do after that. You are > basically asking me to implement the copy-on-write before the memory > management is complete. Perhaps I wasn't clear. What I was trying to say is that we can do "one thing at a time" if we choose to create a "combo device" (the way you proposed). I am not trying to force you to solve all the problems in one go :) > Can you give an example? Or your understanding is incorrect or I missed > the point. So I tried to write it down and realized I was assuming that different cooling-maps can be provided for different cooling strategies (cpufreq/cpuidle) and obviously that's not the case as its per device. Not sure if it would be correct to explore the possibility of doing that. -- viresh
