Hi Zach/Ricardo, All the thermal Kconfigs are enabled in https://wiki.linaro.org/WorkingGroups/PowerManagement/Doc/Kconfig.
Thanks, Amit D On 10 January 2012 23:55, Amit Kucheria <amit.kuche...@linaro.org> wrote: > Amit, could you please add the required Kconfig options that need to > be enabled to > https://wiki.linaro.org/WorkingGroups/PowerManagement/Doc/Kconfig > under Exynos->Thermal? > > Zach and Ricardo will then ensure that their kernels have those > Kconfig options enabled. > > /Amit > > On Wed, Dec 14, 2011 at 6:54 PM, Amit Kachhap <amit.kach...@linaro.org> > wrote: > > Hi Nicolas, > > > > Please pull my samsung thermal implementation work from git repository > > (git://git.linaro.org/people/amitdanielk/linux.git thermal_cpu_cooling). > > Some of the patches are under review and some are in mainline in 3.2 rc* > > version. > > It is all based on the tip of your tree. > > > > The patches are added since commit id > > 971be11492b1e248798f7078592b1fa0dfbf3534 > > > > Thanks, > > Amit Daniel > > > > > > On 14 December 2011 20:11, Amit Kachhap <amit.kach...@linaro.org> wrote: > >> > >> Hi Nicolas, > >> > >> Is it possible for you to add these 2 patches for this month release? I > am > >> not able to give you the git link as there is seems some problem with > the > >> linaro git server. > >> Also I attached the patches in case required. > >> > >> Thanks, > >> Amit Daniel > >> > >> > >> On 13 December 2011 20:43, Amit Daniel Kachhap <amit.kach...@linaro.org > > > >> wrote: > >> > PATCH 1) [thermal: Add a new trip type to use cooling device instance > >> > number] > >> > This patch adds a new trip type THERMAL_TRIP_STATE_ACTIVE which passes > >> > cooling device instance number and may be helpful for cpufreq cooling > >> > devices > >> > to take the correct cooling action. > >> > > >> > PATCH 2) [thermal: Add generic cpu cooling implementation] > >> > This patch adds generic cpu cooling low level implementation through > >> > frequency > >> > clipping and cpu hotplug. In future, other cpu related cooling devices > >> > may be > >> > added here. An ACPI version of this already > >> > exists(drivers/acpi/processor_thermal.c). > >> > But this will be useful for platforms like ARM using the generic > thermal > >> > interface > >> > along with the generic cpu cooling devices. The cooling device > >> > registration API's > >> > return cooling device pointers which can be easily binded with the > >> > thermal zone > >> > trip points. > >> > > >> > > >> > Amit Daniel Kachhap (2): > >> > thermal: Add a new trip type to use cooling device instance number > >> > thermal: Add generic cpu cooling implementation > >> > > >> > Documentation/thermal/cpu-cooling-api.txt | 52 +++++ > >> > Documentation/thermal/sysfs-api.txt | 4 +- > >> > drivers/thermal/Kconfig | 11 + > >> > drivers/thermal/Makefile | 1 + > >> > drivers/thermal/cpu_cooling.c | 302 > >> > +++++++++++++++++++++++++++++ > >> > drivers/thermal/thermal_sys.c | 27 +++- > >> > include/linux/cpu_cooling.h | 45 +++++ > >> > include/linux/thermal.h | 1 + > >> > 8 files changed, 440 insertions(+), 3 deletions(-) > >> > create mode 100644 Documentation/thermal/cpu-cooling-api.txt > >> > create mode 100644 drivers/thermal/cpu_cooling.c > >> > create mode 100644 include/linux/cpu_cooling.h > >> > > >> > > > > > > _______________________________________________ > > linaro-dev mailing list > > linaro-dev@lists.linaro.org > > http://lists.linaro.org/mailman/listinfo/linaro-dev > > >
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