Amit, could you please add the required Kconfig options that need to be enabled to https://wiki.linaro.org/WorkingGroups/PowerManagement/Doc/Kconfig under Exynos->Thermal?
Zach and Ricardo will then ensure that their kernels have those Kconfig options enabled. /Amit On Wed, Dec 14, 2011 at 6:54 PM, Amit Kachhap <amit.kach...@linaro.org> wrote: > Hi Nicolas, > > Please pull my samsung thermal implementation work from git repository > (git://git.linaro.org/people/amitdanielk/linux.git thermal_cpu_cooling). > Some of the patches are under review and some are in mainline in 3.2 rc* > version. > It is all based on the tip of your tree. > > The patches are added since commit id > 971be11492b1e248798f7078592b1fa0dfbf3534 > > Thanks, > Amit Daniel > > > On 14 December 2011 20:11, Amit Kachhap <amit.kach...@linaro.org> wrote: >> >> Hi Nicolas, >> >> Is it possible for you to add these 2 patches for this month release? I am >> not able to give you the git link as there is seems some problem with the >> linaro git server. >> Also I attached the patches in case required. >> >> Thanks, >> Amit Daniel >> >> >> On 13 December 2011 20:43, Amit Daniel Kachhap <amit.kach...@linaro.org> >> wrote: >> > PATCH 1) [thermal: Add a new trip type to use cooling device instance >> > number] >> > This patch adds a new trip type THERMAL_TRIP_STATE_ACTIVE which passes >> > cooling device instance number and may be helpful for cpufreq cooling >> > devices >> > to take the correct cooling action. >> > >> > PATCH 2) [thermal: Add generic cpu cooling implementation] >> > This patch adds generic cpu cooling low level implementation through >> > frequency >> > clipping and cpu hotplug. In future, other cpu related cooling devices >> > may be >> > added here. An ACPI version of this already >> > exists(drivers/acpi/processor_thermal.c). >> > But this will be useful for platforms like ARM using the generic thermal >> > interface >> > along with the generic cpu cooling devices. The cooling device >> > registration API's >> > return cooling device pointers which can be easily binded with the >> > thermal zone >> > trip points. >> > >> > >> > Amit Daniel Kachhap (2): >> > thermal: Add a new trip type to use cooling device instance number >> > thermal: Add generic cpu cooling implementation >> > >> > Documentation/thermal/cpu-cooling-api.txt | 52 +++++ >> > Documentation/thermal/sysfs-api.txt | 4 +- >> > drivers/thermal/Kconfig | 11 + >> > drivers/thermal/Makefile | 1 + >> > drivers/thermal/cpu_cooling.c | 302 >> > +++++++++++++++++++++++++++++ >> > drivers/thermal/thermal_sys.c | 27 +++- >> > include/linux/cpu_cooling.h | 45 +++++ >> > include/linux/thermal.h | 1 + >> > 8 files changed, 440 insertions(+), 3 deletions(-) >> > create mode 100644 Documentation/thermal/cpu-cooling-api.txt >> > create mode 100644 drivers/thermal/cpu_cooling.c >> > create mode 100644 include/linux/cpu_cooling.h >> > >> > > > _______________________________________________ > linaro-dev mailing list > linaro-dev@lists.linaro.org > http://lists.linaro.org/mailman/listinfo/linaro-dev > _______________________________________________ linaro-dev mailing list linaro-dev@lists.linaro.org http://lists.linaro.org/mailman/listinfo/linaro-dev
