Heikki,
Your work, as like the other devs', looks awesome. Before the final
merge, could you make the via placement better via avoiding from the
pads totally (even they have the same net name)? Without special "in pad
via" treatment (which is expensive), they could cause solder paste
losses and assembly issues.
This patch, solves what I'm missing in KiCad for a long time. This is
the final nail on the Eagle's coffin in our company :)
Thanks.
/// Murat
On 03/25/2017 02:21 PM, Heikki Pulkkinen wrote:
Hi,
Any comments, questions!
https://youtu.be/CQC6XMTGxkk
Heikki
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