The way a lady at my work did them was to crack out the bottom piece of the socket to give better access to the pins. She didn't typically put the bottom piece back in since we used the PLCC socket to plug into an emulator pod so there was no need for it (shoulder around the POD connector wouldn't allow it to fit too deeply into the socket. I suppose if you just dropped the bottom of the socket back in place before plugging in the chip that would probably be sufficient.
On Mon, Sep 11, 2017 at 1:23 PM, shadoooo via cctalk <cctalk@classiccmp.org> wrote: > Hello, > in my experience SMD components doesn't need a presoldering operation at > all, because pins are already stained or golded, thus very solderable. > Plus the extra heat could let the pin move inside the plastic, or add > somehow excessive thickness when positioned on the PCB. > In my experience the best option is to clean well the PCB with a > desoldering wick, then add some flux and touch the pads with a thin > soldering iron and some AgPb wire, to dilute the no-Pb alloy on the pads, > which is harder to melt than Pb alloy. > Thanks to flux, surface tension will be low and Agpb alloy will form a thin > layer with no oxide. > Now position the new component, it should seat well in position, without > excessive height over the PCB. > Now with thin iron, heat two opposite pins letting the alloy to melt, and > the component will be held in place. > Now proceed in order with all pins. > > Note: use lower temperatures (<380C, less is better), good quality flux and > AgPb are required for comfortable operation with low risk of damage. > > Andrea >
