On 08/29/2015 01:01 AM, Mark J. Blair wrote:
On Aug 28, 2015, at 19:46, Jon Elson <el...@pico-systems.com> wrote:
Then, the only problem is the temp variation across the size of the oven, which
can be considerable.
I'm thinking that air circulation should be helpful to reduce hot spots,
whether I'm baking boards or media. I expect that I'll get a much better
understanding of how my layout affects things like tombstoning once I reflow my
own boards. I've designed many a board, but other than ones I've hand soldered
myself with irons, they've all been assembled out of sight and out of mind from
me.
Tombstoning is actually quite rare when using good solder
paste. I've done thousands of boards, had a fair share of
head-in-pillow and plain solder failure, but maybe just 6
actual tombstones. Probably the slow temperature ramp with
the toaster oven helps avoid this.
Jon
