On 09/19/2012 06:25:26 AM, José Miguel Gonçalves wrote:
Samsung's S3C24XX SoCs need this in order to generate a binary image
with a padded SPL concatenated with U-Boot.
Signed-off-by: José Miguel Gonçalves <jose.goncal...@inov.pt>
---
Changes for v2:
- None
Changes for v3:
- Changed new binary target name from u-boot-ubl.bin to
u-boot-pad.bin
Changes for v4:
- None
---
Makefile | 11 ++++++-----
1 file changed, 6 insertions(+), 5 deletions(-)
diff --git a/Makefile b/Makefile
index 8738d55..86dedca 100644
--- a/Makefile
+++ b/Makefile
@@ -433,14 +433,15 @@ $(obj)u-boot.sha1: $(obj)u-boot.bin
$(obj)u-boot.dis: $(obj)u-boot
$(OBJDUMP) -d $< > $@
-$(obj)u-boot.ubl: $(obj)spl/u-boot-spl.bin $(obj)u-boot.bin
+$(obj)u-boot-pad.bin: $(obj)spl/u-boot-spl.bin $(obj)u-boot.bin
$(OBJCOPY) ${OBJCFLAGS} --pad-to=$(PAD_TO) -O binary
$(obj)spl/u-boot-spl $(obj)spl/u-boot-spl-pad.bin
- cat $(obj)spl/u-boot-spl-pad.bin $(obj)u-boot.bin >
$(obj)u-boot-ubl.bin
- $(obj)tools/mkimage -n $(UBL_CONFIG) -T ublimage \
- -e $(CONFIG_SYS_TEXT_BASE) -d $(obj)u-boot-ubl.bin
$(obj)u-boot.ubl
- rm $(obj)u-boot-ubl.bin
+ cat $(obj)spl/u-boot-spl-pad.bin $(obj)u-boot.bin >
$(obj)u-boot-pad.bin
rm $(obj)spl/u-boot-spl-pad.bin
This rule lists u-boot-spl.bin as a prerequisite, but it doesn't appear
to use it -- it uses u-boot-spl instead.
It seems that either spl/Makefile should produce u-boot-spl rather than
u-boot-spl.bin and let the toplevel Makefile deal with converting it to
a binary, or spl/Makefile should take care of adding any needed padding
for the target and the final rule should just be a concatenation.
-Scott
_______________________________________________
U-Boot mailing list
U-Boot@lists.denx.de
http://lists.denx.de/mailman/listinfo/u-boot
