On 09/19/2012 11:58:06 AM, José Miguel Gonçalves wrote:
On 19-09-2012 17:10, Scott Wood wrote:
On 09/19/2012 06:25:26 AM, José Miguel Gonçalves wrote:
Samsung's S3C24XX SoCs need this in order to generate a binary image
with a padded SPL concatenated with U-Boot.
I still think "pad" is a lousy name for this. It refers to a minor
implementation detail of how the image was put together.
If you don't like the suggestions in
http://lists.denx.de/pipermail/u-boot/2012-September/134191.html,
how about
"u-boot-with-spl.bin"?
I used a suggestion made by Christian Riesch and accepted by Tom Rini.
I'm totally cool with any name that the U-Boot core maintainers would
like to use, though I would prefer a shorter name than
"u-boot-with-spl.bin" because I'm lazy and don't like to type too
many keys when I upgrade by tftp :-) Because of that I think I would
prefer "u-boot-all.bin". So, everybody agrees with that name?
setenv uboot pathname/u-boot-with-as-much-verbosity-as-you-want.bin
setenv tftpnand 'tftp $loadaddr $uboot && nand erase 0 $filesize &&
nand write $loadaddr 0 $filesize'
saveenv
run tftpnand
:-)
-Scott
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