On Tue, Feb 19, 2019 at 9:59 PM Like Xu <like...@linux.intel.com> wrote:
> > -/* leaf 0xb sub-leaf types */ > > +/* extended topology sub-leaf types */ > > #define INVALID_TYPE 0 > > #define SMT_TYPE 1 > > #define CORE_TYPE 2 > > +#define DIE_TYPE 5 > > This patch set is going to export die topology via sysfs > while the extended topology sub-leaf type could be one of followings: > SMT/Core/Module/Tile/Die according to CPUID.1F from SDM. > > Why not choose to export module/tile topology as well? Excellent question. (and thank you for reading the SDM:-) While it is true that there are shipping products with software-visible CPU modules and tiles, they shipped before this mechanism was available. As a result, there are currently zero products that use this mechanism to enumerate modules and tiles. If future products have software-visible modules and tiles, and they choose to use this mechanism, we can add support for them. But I do not advocate adding code to the kernel "just in case". In contrast, the need to support multi-die/package products as soon as possible is quite clear. thanks, Len Brown, Intel Open Source Technology Center
