Soldering my very first bga-style packages (5 ball CSP). On the hotplate, as usual. At 3 minutes everything else melts and reflows, but nothing for the CSPs. Hmmm, maybe they did and I didn't notice. Nope, they popped right off. Sigh.
So I place them again, add a few drops of paste around them so I know what temp they're up to, and heat them again. I watch ONE of them carefully, and sure enough, about 30-60 seconds after my paste melts, the balls melt and the chips settle. Oh yeah, lead-free needs a higher temperature. Sigh. _______________________________________________ geda-user mailing list [email protected] http://www.seul.org/cgi-bin/mailman/listinfo/geda-user
