Is the intent to practice iron
soldering,
or test oven bake cycles with solder paste?
DJ Delorie wrote:
The questions are: What footprints to use for a proper "challenge"?
We've got four each for the 0201 through 0805 parts, and I can make
the two ICs have either long or short pads. Plus, what about solder
mask?
For score and snap FR-1 board material, I've been thinking a IR reflective wide
clearance solder mask would keep the board from heating up everywhere and
getting to hot, but still cook where you need it. But with a wide clearance you
would also need a normal solder mask.
My first thought is it could be a helpful test aid if it had graduated versions
between close to chip legs/lands sizes and oversize that let lots of solder
cling on. By oversize, I mean only in the direction of chip leg lengths, not
fatter.
John G
What's ideal? Or should we make it more challenging (and
perhaps cheaper) by not having one at all?
I'm also figuring score-and-snap to separate the boards. I can leave
a bigger border if I go to double sided.
Comments?
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