Rick Hawkins <[EMAIL PROTECTED]> wrote
> They work wonderfully. I have a k6-166 running at 210/83
> quite happilly. However, it needs some cooling at this
> speed; until i get something more than this cheesy $2 fan,
> I need to keep the side off to compile (but not at
> 166/66).
How is the heatsink (between the fan and the CPU,
right?) attached to the CPU? Are you using heatsink
compound (thermal compound, heatsink grease) between
the heatsink and the CPU?
Does anyone have any experience with this? In
the old days, voltage regulators and power transistors
and such hot-running ICs usually were not just attached
to their heatsinks bare, but were smeared with
heatsink/thermal compound first in order to provide better
heat transfer than a bare connection would provide.
However, I have gathered that the typical CPU
heatsink is just put on bare. Is this just laziness
on the part of assemblers or is there some legitimate
reason to think the heatsink compound is not needed
with CPUs?
-- Frank
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