On 2017-Mar-24, at 11:06 AM, Paul Koning via cctalk wrote: > Which makes sense; DIP packages (independent of material) are designed to a > small set of standard dimensions. 0.1 inch lead pitch, pin spacing 0.300 or > 0.400 or 0.600 or similar round numbers.
One (perhaps the singular) exception to this is the DCJ11 (pdp11 microproc), a 60-pin DIP with an over-wide body, ~ 1&9/32 in / 33mm, but then it's an unusual hybrid / dual-chip ceramic package.
