On Mon, Jan 16, 2017 at 12:35 PM, Jon Elson <el...@pico-systems.com> wrote:
> [...] a pump makes it work 10X better. The trick, as described in the Pace > manuals, is you heat the connection for several seconds, then apply vacuum > and orbit the tip so it moves the component pin in the plated through > hole. That orbiting gets ALL the solder out of the hole. > While I wholeheartedly agree with the tool advice and the trick, I lifted a bunch of traces on a PDP8a CPU board doing this. I don't know if it was the particular board or generally crappy manufacturing at issue here. All the HP test equipment I've fixed, most if not all from 1985+-7, survived worse punishment. I've also started reflowing and adding fresh solder before attempting to desolder. Could be better heat transfer, or just easier to suck up a larger blob. b
