Hi Roy. The hottest components on the B200mini-i are the ADI RF Integrated Transceiver (AD9364), the Xilinx Spartan 6 FPGA (XC6SLX75-3CSG484I), and the Cypress FX3 USB chip (CYUSB3014-BZXI). Consult the datasheets for the max. recommended junction temperature of these devices.
-Robin On Mon, Jul 24, 2017 at 8:57 AM, רועי via USRP-users < usrp-users@lists.ettus.com> wrote: > Hi all, > > > I read that the stated temperature range for the B200mini-i is 0-45degC. > In my application, the required temperature range is -20-60degC. However, > I cannot afford the use of enclosure (due to weight limitations), therefore > I need to come up with my own cooling solution. Can you please provide some > information regarding the temperature range of key components in the > device, the most vulnerable and the ones who dissipate heat the most? This > way I could focus my effort on them. > > > Best regards, > > Roy > > > > _______________________________________________ > USRP-users mailing list > USRP-users@lists.ettus.com > http://lists.ettus.com/mailman/listinfo/usrp-users_lists.ettus.com > >
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