Hi Varadarajan, On 2026-06-17T10:17:59, Varadarajan Narayanan <[email protected]> wrote:
> mach-snapdragon: Add commands to create wrapper ELF Patches 1 and 2 introduce binman etypes (qcom-config, qcom-lib, qcom-appsbl) to build the next-stage FIT, but patch 11 then drops back to a custom Makefile.xpl + linker-script mechanism to wrap the SPL in an ELF for the boot ROM. Two image-creation mechanisms for the same SoC is what binman exists to avoid. Please can you see whether the wrap-elf step can be expressed as a binman entry (an objcopy/ld wrapping etype, or extending the existing qcom-* etypes) so the whole flow lives in the binman dts? > Working features ... Serial console, UART, MMC Serial console and UART are the same thing here. Regards, Simon
