Hi Roger,
On 15/06/22 19:14, Roger Quadros wrote:
Hi Neha,
On 15/06/2022 09:48, Neha Malcom Francis wrote:
tispl.bin is to be packaged (with ATF, OPTEE, DM and A72 SPL) using
binman. The tispl.bin target from the makefile is no longer needed for
J721E.
Signed-off-by: Neha Malcom Francis <n-fran...@ti.com>
---
arch/arm/mach-k3/config.mk | 5 +++++
scripts/Makefile.spl | 2 ++
2 files changed, 7 insertions(+)
diff --git a/arch/arm/mach-k3/config.mk b/arch/arm/mach-k3/config.mk
index d706d17788..dd5e42d9df 100644
--- a/arch/arm/mach-k3/config.mk
+++ b/arch/arm/mach-k3/config.mk
@@ -74,6 +74,7 @@ ifeq ($(CONFIG_SOC_K3_J721E),)
export DM := /dev/null
endif
+ifndef CONFIG_TARGET_J721E_A72_EVM
How about using #ifndef CONFIG_BINMAN instead? Any platform enabling that
doesn't want to use the old way.
You are still breaking HS functionality with this series correct?
That will have to be fixed.
One proposal was discussed here
https://lore.kernel.org/all/76474ded-a782-f491-eac6-ece3c5f4a...@gmail.com/
We should be able to produce tispl.bin_HS and u-boot.img_HS via binman.
You have already covered most of the x509 stuff image in ti-x509-cert etype.
Please refer to below script [1] to know what is required to get _HS images.
[1]
https://git.ti.com/cgit/security-development-tools/core-secdev-k3/tree/scripts/secure-binary-image.sh
Yes, this patch was intended for GP only but like Andrew said, will have
to do HS as well.
I'll build on this patch for HS devices.
ifeq ($(CONFIG_TI_SECURE_DEVICE),y)
SPL_ITS := u-boot-spl-k3_HS.its
$(SPL_ITS): export IS_HS=1
@@ -98,9 +99,11 @@ cmd_k3_mkits = \
$(SPL_ITS): FORCE
$(call cmd,k3_mkits)
endif
+endif
else
+ifndef CONFIG_TARGET_J721E_A72_EVM
ifeq ($(CONFIG_TI_SECURE_DEVICE),y)
INPUTS-y += u-boot.img_HS
else
@@ -108,4 +111,6 @@ INPUTS-y += u-boot.img
endif
endif
+endif
+
You will have to enclose below line in #ifndef CONFIG_BINMAN as well.
Will make the changes.
include $(srctree)/arch/arm/mach-k3/config_secure.mk
diff --git a/scripts/Makefile.spl b/scripts/Makefile.spl
index f047d4e094..6104cb8587 100644
--- a/scripts/Makefile.spl
+++ b/scripts/Makefile.spl
@@ -591,6 +591,8 @@ $(obj)/$(SPL_BIN).multidtb.fit.lzo:
$(obj)/$(SPL_BIN).multidtb.fit
@lzop -f9 $< > $@
ifdef CONFIG_ARCH_K3
+ifndef CONFIG_TARGET_J721E_A72_EVM
Is this still being called in-spite of the changes to config.mk?
Please use CONFIG_BINMAN instead of CONFIG_TARGET_J721E_A72_EVM
I will make the changes.
tispl.bin: $(obj)/u-boot-spl-nodtb.bin $(SHRUNK_ARCH_DTB) $(SPL_ITS) FORCE
$(call if_changed,mkfitimage)
endif
+endif
cheers,
-roger
--
Thanking You
Neha Malcom Francis
