Re: WIP: Signing TI x509 certificates using binman

2023-04-03 Thread Neha Malcom Francis
Hi Simon On 03/04/23 00:16, Simon Glass wrote: Hi Neha, On Mon, 3 Apr 2023 at 02:19, Neha Malcom Francis wrote: Hi Simon On 02/04/23 18:00, Neha Malcom Francis wrote: Hi Simon On 01/04/23 12:02, Simon Glass wrote: Hi Neha, On Sat, 1 Apr 2023 at 00:14, Neha Malcom Francis wrote: Hi Si

Re: WIP: Signing TI x509 certificates using binman

2023-04-02 Thread Simon Glass
Hi Neha, On Mon, 3 Apr 2023 at 02:19, Neha Malcom Francis wrote: > > Hi Simon > > On 02/04/23 18:00, Neha Malcom Francis wrote: > > Hi Simon > > > > On 01/04/23 12:02, Simon Glass wrote: > >> Hi Neha, > >> > >> On Sat, 1 Apr 2023 at 00:14, Neha Malcom Francis > >> wrote: > >>> > >>> Hi Simon > >

Re: WIP: Signing TI x509 certificates using binman

2023-04-02 Thread Neha Malcom Francis
Hi Simon On 02/04/23 18:00, Neha Malcom Francis wrote: Hi Simon On 01/04/23 12:02, Simon Glass wrote: Hi Neha, On Sat, 1 Apr 2023 at 00:14, Neha Malcom Francis wrote: Hi Simon On 31/03/23 02:01, Simon Glass wrote: Hi Neha, On Fri, 24 Mar 2023 at 22:28, Neha Malcom Francis wrote: Hi

Re: WIP: Signing TI x509 certificates using binman

2023-04-02 Thread Neha Malcom Francis
Hi Simon On 01/04/23 12:02, Simon Glass wrote: Hi Neha, On Sat, 1 Apr 2023 at 00:14, Neha Malcom Francis wrote: Hi Simon On 31/03/23 02:01, Simon Glass wrote: Hi Neha, On Fri, 24 Mar 2023 at 22:28, Neha Malcom Francis wrote: Hi Simon, Before I roll out the entire series that works for

Re: WIP: Signing TI x509 certificates using binman

2023-03-31 Thread Simon Glass
Hi Neha, On Sat, 1 Apr 2023 at 00:14, Neha Malcom Francis wrote: > > Hi Simon > > On 31/03/23 02:01, Simon Glass wrote: > > Hi Neha, > > > > On Fri, 24 Mar 2023 at 22:28, Neha Malcom Francis wrote: > >> > >> Hi Simon, > >> > >> Before I roll out the entire series that works for packaging K3 > >>

Re: WIP: Signing TI x509 certificates using binman

2023-03-31 Thread Neha Malcom Francis
Hi Simon On 31/03/23 02:01, Simon Glass wrote: Hi Neha, On Fri, 24 Mar 2023 at 22:28, Neha Malcom Francis wrote: Hi Simon, Before I roll out the entire series that works for packaging K3 bootloader images, wanted to get some reviews and comments regarding the implementation of the signing e

Re: WIP: Signing TI x509 certificates using binman

2023-03-30 Thread Simon Glass
Hi Neha, On Fri, 24 Mar 2023 at 22:28, Neha Malcom Francis wrote: > > Hi Simon, > > Before I roll out the entire series that works for packaging K3 > bootloader images, wanted to get some reviews and comments regarding the > implementation of the signing etype [1] . I believe I've taken into > co

WIP: Signing TI x509 certificates using binman

2023-03-24 Thread Neha Malcom Francis
Hi Simon, Before I roll out the entire series that works for packaging K3 bootloader images, wanted to get some reviews and comments regarding the implementation of the signing etype [1] . I believe I've taken into consideration what we've discussed earlier [2]. Let me know your thoughts. Th