On Mon, 05 Aug 2024 19:59:30 +0530, Dhruva Gole wrote:
> This series aims to add documentation around the boot flow and tispl
> packaging details regarding the TIFS Stub. While at it, also refactors the
> k3 common docs to add more labels to provide more granularity on how we
> include chunks from
Hello,
This series aims to add documentation around the boot flow and tispl
packaging details regarding the TIFS Stub. While at it, also refactors the
k3 common docs to add more labels to provide more granularity on how we
include chunks from common docs into SoC specific docs.
This series also i
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