For EEH on PowerNV platform, the overall architecture is different
from that on pSeries platform. In order to support multiple I/O chips
in future, we split EEH to 3 layers for PowerNV platform: EEH core,
platform layer, I/O layer. It would give EEH implementation on PowerNV
platform much more flex
For EEH on PowerNV platform, the overall architecture is different
from that on pSeries platform. In order to support multiple I/O chips
in future, we split EEH to 3 layers for PowerNV platform: EEH core,
platform layer, I/O layer. It would give EEH implementation on PowerNV
platform much more flex
