Re: [PATCH] thermal: Bind cooling devices with the correct arguments

2014-07-02 Thread edubez...@gmail.com
Punit, On Tue, Jun 3, 2014 at 5:59 AM, Punit Agrawal wrote: > When binding cooling devices to thermal zones created from the device > tree the minimum and maximum cooling states are in the wrong order > leading to failure to bind. > > Fix the order of cooling states in the call to > thermal_zone_

Re: [PATCH] thermal: Bind cooling devices with the correct arguments

2014-06-24 Thread Punit Agrawal
Stephen Boyd writes: > On 06/17/14 03:20, Punit Agrawal wrote: >> Ping? >> >> Punit Agrawal writes: >> >>> When binding cooling devices to thermal zones created from the device >>> tree the minimum and maximum cooling states are in the wrong order >>> leading to failure to bind. >>> >>> Fix the

Re: [PATCH] thermal: Bind cooling devices with the correct arguments

2014-06-18 Thread Stephen Boyd
On 06/17/14 03:20, Punit Agrawal wrote: > Ping? > > Punit Agrawal writes: > >> When binding cooling devices to thermal zones created from the device >> tree the minimum and maximum cooling states are in the wrong order >> leading to failure to bind. >> >> Fix the order of cooling states in the cal

Re: [PATCH] thermal: Bind cooling devices with the correct arguments

2014-06-17 Thread Punit Agrawal
Ping? Punit Agrawal writes: > When binding cooling devices to thermal zones created from the device > tree the minimum and maximum cooling states are in the wrong order > leading to failure to bind. > > Fix the order of cooling states in the call to > thermal_zone_bind_cooling_device to fix thi