On Mon, May 25, 2020 at 04:16:05PM +0300, Jarkko Nikula wrote:
> Hi
>
> On 5/21/20 5:37 AM, Serge Semin wrote:
> > On Wed, May 20, 2020 at 03:46:11PM +0300, Jarkko Nikula wrote:
> > > Hi
> > >
> > > On 5/10/20 12:50 PM, Serge Semin wrote:
> > > > Seeing the DW I2C platform driver is getting overc
On Mon, May 25, 2020 at 04:16:05PM +0300, Jarkko Nikula wrote:
> On 5/21/20 5:37 AM, Serge Semin wrote:
> For this patchset I'd like more if changes are done to
> i2c-designware-platdrv.c since it's not too complicated yet :-)
And after moving ACPI stuff to common code, the one has even been shru
Hi
On 5/21/20 5:37 AM, Serge Semin wrote:
On Wed, May 20, 2020 at 03:46:11PM +0300, Jarkko Nikula wrote:
Hi
On 5/10/20 12:50 PM, Serge Semin wrote:
Seeing the DW I2C platform driver is getting overcomplicated with a lot of
vendor-specific configs let's introduce a glue-layer interface so new
On Wed, May 20, 2020 at 03:46:11PM +0300, Jarkko Nikula wrote:
> Hi
>
> On 5/10/20 12:50 PM, Serge Semin wrote:
> > Seeing the DW I2C platform driver is getting overcomplicated with a lot of
> > vendor-specific configs let's introduce a glue-layer interface so new
> > platforms which equipped with
Hi
On 5/10/20 12:50 PM, Serge Semin wrote:
Seeing the DW I2C platform driver is getting overcomplicated with a lot of
vendor-specific configs let's introduce a glue-layer interface so new
platforms which equipped with Synopsys Designware APB I2C IP-core would
be able to handle their peculiaritie
Seeing the DW I2C platform driver is getting overcomplicated with a lot of
vendor-specific configs let's introduce a glue-layer interface so new
platforms which equipped with Synopsys Designware APB I2C IP-core would
be able to handle their peculiarities in the dedicated objects.
The generic platf
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