Re: Fwd: [linux-next:master 4380/4439] include/linux/fortify-string.h:293:17: error: call to '__write_overflow' declared with attribute error: detected write beyond size of object (1st parameter)

2024-10-20 Thread Yafang Shao
On Fri, Oct 18, 2024 at 2:00 AM Kees Cook wrote: > > On Thu, Oct 17, 2024 at 09:48:18AM -0700, Kees Cook wrote: > > On Thu, Oct 17, 2024 at 09:23:25AM -0700, Kees Cook wrote: > > > On Thu, Oct 17, 2024 at 09:07:13AM -0700, Kees Cook wrote: > > > > Something in the .config is causing the error. (!?

[PATCH v3 5/6] dt-bindings: arm: qcom: Add SM7325 Nothing Phone 1

2024-10-20 Thread Danila Tikhonov
Nothing Phone 1 (nothing,spacewar) is a smartphone based on the SM7325 SoC. Signed-off-by: Danila Tikhonov Reviewed-by: Krzysztof Kozlowski --- Documentation/devicetree/bindings/arm/qcom.yaml | 6 ++ 1 file changed, 6 insertions(+) diff --git a/Documentation/devicetree/bindings/arm/qcom.ya

[PATCH v3 0/6] Add Nothing Phone (1) support

2024-10-20 Thread Danila Tikhonov
This series of patches adds support for the Nothing Phone (1), identified as nothing,spacewar. The Nothing Phone (1) is built on the Qualcomm Snapdragon 778G+ (SM7325-AE, also known as yupik). SM7325 is identical to SC7280 just as SM7125 is identical to SC7180, so SM7325 devicetree imports SC7280

[PATCH v3 1/6] dt-bindings: nfc: nxp,nci: Document PN553 compatible

2024-10-20 Thread Danila Tikhonov
The PN553 is another NFC chip from NXP, document the compatible in the bindings. Signed-off-by: Danila Tikhonov Acked-by: Krzysztof Kozlowski Acked-by: Rob Herring (Arm) --- Documentation/devicetree/bindings/net/nfc/nxp,nci.yaml | 1 + 1 file changed, 1 insertion(+) diff --git a/Documentation

[PATCH v3 2/6] dt-bindings: arm: cpus: Add qcom kryo670 compatible

2024-10-20 Thread Danila Tikhonov
The Qualcomm Snapdragon 778G/778G+/780G/782G uses CPUs named Kryo 670. Add the compatible string in the documentation. Signed-off-by: Danila Tikhonov Acked-by: Krzysztof Kozlowski --- Documentation/devicetree/bindings/arm/cpus.yaml | 1 + 1 file changed, 1 insertion(+) diff --git a/Documentati

[PATCH v3 6/6] arm64: dts: qcom: sm7325: Add device-tree for Nothing Phone 1

2024-10-20 Thread Danila Tikhonov
From: Eugene Lepshy Add device tree for the Nothing Phone 1 (nothing,spacewar) smartphone which is based on the SM7325 SoC. Supported features are, as of now: * USB & UFS * Debug UART * Display via SimpleFB * Power & volume buttons * PMIC GLink * Remoteprocs (ADSP, CDSP, MPSS, WPSS) * WiFi & Blu

[PATCH v3 3/6] arm64: dts: qcom: Add SM7325 device tree

2024-10-20 Thread Danila Tikhonov
From: Eugene Lepshy The Snapdragon 778G (SM7325) / 778G+ (SM7325-AE) / 782G (SM7325-AF) is software-wise very similar to the Snapdragon 7c+ Gen 3 (SC7280). It uses the Kryo670. Signed-off-by: Eugene Lepshy Signed-off-by: Danila Tikhonov Reviewed-by: Dmitry Baryshkov --- arch/arm64/boot/dts/

[PATCH v3 4/6] dt-bindings: vendor-prefixes: Add Nothing Technology Limited

2024-10-20 Thread Danila Tikhonov
Add entry for Nothing Technology Limited (https://nothing.tech/) Signed-off-by: Danila Tikhonov Acked-by: Krzysztof Kozlowski --- Documentation/devicetree/bindings/vendor-prefixes.yaml | 2 ++ 1 file changed, 2 insertions(+) diff --git a/Documentation/devicetree/bindings/vendor-prefixes.yaml

Re: [PATCH v1 1/2] mseal: Two fixes for madvise(MADV_DONTNEED) when sealed

2024-10-20 Thread kernel test robot
ig (https://download.01.org/0day-ci/archive/20241020/202410201724.kkcsansw-...@intel.com/config) compiler: clang version 18.1.8 (https://github.com/llvm/llvm-project 3b5b5c1ec4a3095ab096dd780e84d7ab81f3d7ff) reproduce (this is a W=1 build): (https://download.01.org/0day-ci/archive/20241020/20241020172

Re: [PATCH v1 1/2] mseal: Two fixes for madvise(MADV_DONTNEED) when sealed

2024-10-20 Thread kernel test robot
ig (https://download.01.org/0day-ci/archive/20241020/202410201611.xd6j8qcm-...@intel.com/config) compiler: gcc-12 (Debian 12.2.0-14) 12.2.0 reproduce (this is a W=1 build): (https://download.01.org/0day-ci/archive/20241020/202410201611.xd6j8qcm-...@intel.com/reproduce) If you fix the issue in a sepa