From: "hongbo.zhang"
utils/heat_cpu output file should be ignored by git.
also add *.patch into .gitignore.
Signed-off-by: hongbo.zhang
---
.gitignore | 2 ++
1 file changed, 2 insertions(+)
diff --git a/.gitignore b/.gitignore
index e21ff87..02090c0 100644
--- a/.gitignore
+++ b/
From: "hongbo.zhang"
if there is no thermal zone, all the thermal tests should be skipped.
Signed-off-by: hongbo.zhang
---
thermal/thermal_sanity.sh | 33 +
thermal/thermal_sanity.txt | 1 +
2 files changed, 34 insertions(+)
create mode 1007
From: "hongbo.zhang"
the greater-than symbol ">" in if state isn't valid and a file named "0" will
be created in this case, "-gt" should be used instead.
Signed-off-by: hongbo.zhang
---
include/thermal_functions.sh | 2 +-
1 file changed, 1 i
From: "hongbo.zhang"
This driver is based on the thermal management framework in thermal_sys.c. A
thermal zone device is created with the trip points to which cooling devices
can be bound, the current cooling device is cpufreq, e.g. CPU frequency is
clipped down to cool the CPU,
From: "hongbo.zhang"
V5->V6 Changes:
In patch "Thermal: Add ST-Ericsson DB8500 thermal driver":
- Add depends on ARCH_U8500 in Kconfig
In patch "Thermal: Add ST-Ericsson DB8500 thermal properties and platform
- Add Acked-by: Linus Walleij
hongbo.zhang (2)
From: "hongbo.zhang"
This patch adds device tree properties for ST-Ericsson DB8500 thermal driver,
also adds the platform data to support the old fashion.
Signed-off-by: hongbo.zhang
Reviewed-by: Viresh Kumar
Acked-by: Linus Walleij
---
arch/arm/boot/dts/dbx5x0.dtsi
From: "hongbo.zhang"
This driver is based on the thermal management framework in thermal_sys.c. A
thermal zone device is created with the trip points to which cooling devices
can be bound, the current cooling device is cpufreq, e.g. CPU frequency is
clipped down to cool the CPU,
From: "hongbo.zhang"
V4->V5 Changes:
In patch "Thermal: Add ST-Ericsson DB8500 thermal driver":
- use flush_work instead of flush_work_sync since the later is deprecated now.
- parameter trip_points of db8500_thermal_match_cdev is renamed to trip_point;
- re-order
From: "hongbo.zhang"
This patch adds device tree properties for ST-Ericsson DB8500 thermal driver,
also adds the platform data to support the old fashion.
Signed-off-by: hongbo.zhang
Reviewed-by: Viresh Kumar
---
arch/arm/boot/dts/dbx5x0.dtsi | 14 +
arch/ar
From: "hongbo.zhang"
This driver is based on the thermal management framework in thermal_sys.c. A
thermal zone device is created with the trip points to which cooling devices
can be bound, the current cooling device is cpufreq, e.g. CPU frequency is
clipped down to cool the CPU,
From: "hongbo.zhang"
This patch adds device tree properties for ST-Ericsson DB8500 thermal driver,
also adds the platform data to support the old fashion.
Signed-off-by: hongbo.zhang
Reviewed-by: Viresh Kumar
---
arch/arm/boot/dts/dbx5x0.dtsi | 14 +
arch/ar
From: "hongbo.zhang"
V3->V4 Changes:
1. In previous patch set V3 "Fix thermal bugs and Upstream ST-Ericsson thermal
driver", there were 5 patches in total, since the first 3 for fixing thermal
layer bugs have been accepted by the maintainer, I'd like to send out
From: "hongbo.zhang"
This diver is based on the thermal management framework in thermal_sys.c. A
thermal zone device is created with the trip points to which cooling devices
can be bound, the current cooling device is cpufreq, e.g. CPU frequency is
clipped down to cool the CPU, and oth
From: "hongbo.zhang"
V2->V3 Changes:
1. Moved the previous "[PATCH V2 2/6] Thermal: make sure cpufreq cooling
register after cpufreq driver" from generic cpu cooling layer to ST-Ericsson
driver, thus only 5 patches in total in V3 patch set.
2. Update ST-Ericsson therm
From: "hongbo.zhang"
Problem of using this list is that the cpufreq_get_max_state callback will be
called when register cooling device by thermal_cooling_device_register, but
this list isn't ready at this moment. What's more, there is no need to maintain
suc
From: "hongbo.zhang"
This patch adds device tree properties for ST-Ericsson DB8500 thermal driver,
also adds the platform data to support the old fashion.
Signed-off-by: hongbo.zhang
---
arch/arm/boot/dts/dbx5x0.dtsi | 14 +
arch/arm/boot/dts/snowball.dt
From: "hongbo.zhang"
In the while loop for counting cpu frequencies, if table[i].frequency equals
CPUFREQ_ENTRY_INVALID, index i won't be increased, so this leads to an endless
loop, what's more the index i cannot be referred as cpu frequencies number if
there is CPUFRE
From: "hongbo.zhang"
The curly bracket should be aligned with corresponding if else statements.
Signed-off-by: hongbo.zhang
Reviewed-by: Viresh Kumar
---
drivers/thermal/cpu_cooling.c | 2 +-
1 file changed, 1 insertion(+), 1 deletion(-)
diff --git a/drivers/thermal/cpu_cooling.c
From: "hongbo.zhang"
Problem of using this list is that the cpufreq_get_max_state callback will be
called when register cooling device by thermal_cooling_device_register, but
this list isn't ready at this moment. What's more, there is no need to maintain
suc
From: "hongbo.zhang"
This patch adds device tree properties for ST-Ericsson DB8500 thermal driver,
also adds the platform data to support the old fashion.
Signed-off-by: hongbo.zhang
---
arch/arm/boot/dts/dbx5x0.dtsi | 14 +
arch/arm/boot/dts/snowball.dt
From: "hongbo.zhang"
This patch adds device tree properties for ST-Ericsson DB8500 thermal driver,
also adds the platform data to support the old fashion.
Signed-off-by: hongbo.zhang
---
arch/arm/boot/dts/dbx5x0.dtsi | 14 +
arch/arm/boot/dts/snowball.dt
From: "hongbo.zhang"
This diver is based on the thermal management framework in thermal_sys.c. A
thermal zone device is created with the trip points to which cooling devices
can be bound, the current cooling device is cpufreq, e.g. CPU frequency is
clipped down to cool the CPU, and oth
From: "hongbo.zhang"
This diver is based on the thermal management framework in thermal_sys.c. A
thermal zone device is created with the trip points to which cooling devices
can be bound, the current cooling device is cpufreq, e.g. CPU frequency is
clipped down to cool the CPU, and oth
From: "hongbo.zhang"
This patch adds device tree properties for ST-Ericsson DB8500 thermal driver,
also adds the platform data to support the old fashion.
Signed-off-by: hongbo.zhang
---
.../devicetree/bindings/thermal/db8500-thermal.txt | 40 ++
arch/arm/boot/dts/d
From: "hongbo.zhang"
In the while loop for counting cpu frequencies, if table[i].frequency equals
CPUFREQ_ENTRY_INVALID, index i won't be increased, so this leads to an endless
loop, what's more the index i cannot be referred as cpu frequencies number if
there is CPUFRE
From: "hongbo.zhang"
Problem of using this list is that the cpufreq_get_max_state callback will be
called when register cooling device by thermal_cooling_device_register, but
this list isn't ready at this moment. What's more, there is no need to maintain
suc
From: "hongbo.zhang"
The cpufreq works as a cooling device, so the cooling layer should check if the
cpufreq driver is initialized or not.
Signed-off-by: hongbo.zhang
---
drivers/thermal/cpu_cooling.c | 4
1 file changed, 4 insertions(+)
diff --git a/drivers/thermal/cpu_c
From: "hongbo.zhang"
The curly bracket should be aligned with corresponding if else statements.
Signed-off-by: hongbo.zhang
Reviewed-by: Viresh Kumar
---
drivers/thermal/cpu_cooling.c | 2 +-
1 file changed, 1 insertion(+), 1 deletion(-)
diff --git a/drivers/thermal/cpu_cooling.c
From: "hongbo.zhang"
V1->V2 Changes:
DB8500 thermal dirver: Accept comments from Francesco Lavra and Viresh Kumar,
and split platform and driver parts into separate patches.
Thermal layer: Cancel the patch for deferring bind due to new patch for generic
cpu cooling layer to f
From: "hongbo.zhang"
This diver is based on the thermal management framework in thermal_sys.c.
A thermal zone device is created with the trip points to which cooling
devices can be bound, the current cooling device is cpufreq, e.g. CPU
frequency is clipped down to cool the CPU, and oth
From: "hongbo.zhang"
The cpufreq works as a cooling device, so the cooling layer should
check and wait until the cpufreq driver is initialized.
Signed-off-by: hongbo.zhang
---
drivers/thermal/cpu_cooling.c | 12 +++-
1 file changed, 11 insertions(+), 1 deletion(-)
di
From: "hongbo.zhang"
In the previous bind function, cdev->get_max_state(cdev, &max_state) is called
before the registration function finishes, but at this moment, the parameter
cdev at thermal driver layer isn't ready--it will get ready only after its
registration, so
From: "hongbo.zhang"
Hi all,
This patch set is to upstream ST-Ericsson thermal driver and fix some bugs
of thermal layer at the same time.
All of these patches are based on v3.7-rc1.
[PATCH 1/5] Thermal: do bind operation after thermal zone or cooling
device register returns.
In th
From: "hongbo.zhang"
Is is not reliable to check the list entry pointer after
list_for_each_entry loop, list_empty should be used instead.
Signed-off-by: hongbo.zhang
---
drivers/thermal/cpu_cooling.c | 5 +++--
1 file changed, 3 insertions(+), 2 deletions(-)
diff --git a/drive
From: "hongbo.zhang"
Signed-off-by: hongbo.zhang
---
drivers/thermal/cpu_cooling.c | 2 +-
1 file changed, 1 insertion(+), 1 deletion(-)
diff --git a/drivers/thermal/cpu_cooling.c b/drivers/thermal/cpu_cooling.c
index cc1c930..b6b4c2a 100644
--- a/drivers/thermal/cpu_cooling.c
+++
From: "hongbo.zhang"
This diver is based on the thermal management framework in thermal_sys.c.
A thermal zone device is created with the trip points to which cooling
devices can be binded, the current cooling device is cpufreq, e.g. CPU
frequency is clipped down to cool the CPU,
From: "hongbo.zhang"
This patch sets contains two patches:
[PATCH 1/2] Thermal: Move struct thermal_cooling_device_instance to thermal.h
Note:
Declaration of struct thermal_cooling_device_instance should be moved to public
header file thermal.h, because a thermal zone driver need to o
From: "hongbo.zhang"
A thermal driver may need to walk through the cooling devices binded to
itself, which are listed in cooling_devices of thermal_zone_device, and
this goal cannot be achieved without moving this structure declaration
to the public header file.
Signed-off-by: ho
From: "hongbo.zhang"
Signed-off-by: hongbo.zhang
---
cpufreq/cpufreq_04.sh |7 ++-
cpufreq/cpufreq_05.sh | 54 +
cpufreq/cpufreq_06.sh |6 ++
cpufreq/cpufreq_07.sh |6 ++
cpufreq/cpufreq_08.sh |6 +
From: "hongbo.zhang"
If we want to set one cpufreq governor mode, we must check this mode is
supported or not before setting it.
Otherwise we will get failure reported, this differs from the case that one
mode is said to be supported but doesn't work well at all.
hongbo.zhang
From: "hongbo.zhang"
Signed-off-by: hongbo.zhang
---
arch/arm/configs/u8500_defconfig |4 +
arch/arm/mach-ux500/board-mop500.c | 69
drivers/thermal/Kconfig | 20 ++
drivers/thermal/Makefile |4 +-
drive
From: "hongbo.zhang"
Signed-off-by: hongbo.zhang
---
drivers/thermal/cpu_cooling.c |3 +--
1 file changed, 1 insertion(+), 2 deletions(-)
diff --git a/drivers/thermal/cpu_cooling.c b/drivers/thermal/cpu_cooling.c
index c40d9a0..a8aa10f 100644
--- a/drivers/thermal/cpu_cooli
From: "hongbo.zhang"
Hi all,
This is the ST-Ericsson db8500 thermal dirver, here are some notes of this
patch set:
1.
0001-Remove-un-necessary-variable-checking.patch is a trivial update of the
thermal framework.
0002-ST-Ericsson-db8500-thermal-dirver.patch is the ST-Ericsson db85
From: "hongbo.zhang"
---
arch/arm/configs/u8500_defconfig |4 +
arch/arm/mach-ux500/board-mop500.c | 71
drivers/thermal/Kconfig | 16 +
drivers/thermal/Makefile |4 +-
drivers/thermal/cpu
From: "hongbo.zhang"
---
arch/arm/configs/u8500_defconfig |2 ++
drivers/power/Makefile |2 +-
2 files changed, 3 insertions(+), 1 deletion(-)
diff --git a/arch/arm/configs/u8500_defconfig b/arch/arm/configs/u8500_defconfig
index 889d73a..4dc11da 100644
--- a/arch/a
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