Re: [RFC PATCH 1/2] thermal: Add a new trip type to use cooling device instance number

const struct thermal_cooling_device_ops *); +const struct thermal_cooling_device_ops *, unsigned long private); void thermal_cooling_device_unregister(struct thermal_cooling_device *); #ifdef CONFIG_NET -- Matthew Garrett | mj...@srcf.ucam.org

Re: [RFC PATCH 2/2] thermal: Add generic cpu cooling implementation

e thermal layer. ACPI already plugs in via the passive trip points. If we're going to do this then I'd like to see the ACPI code merged in with the generic cpu cooling code. -- Matthew Garrett | mj...@srcf.ucam.org ___ linaro-dev mailing l

Re: Freescale Linux BSP review

question. If Linaro's reference kernel is intended to include whatever's necessary to get hardware working, upstream-suitable or otherwise, then there's not much point in worrying about it. -- Matthew Garrett | mj...@srcf.ucam.org ___ lin