See everyone tomorrow.
Feel free to add to the agenda:
https://wiki.linaro.org/Platform/Android/Meetings/2012-05-09
Also, please list your status. Thanks!
--
Zach Pfeffer
Android Platform Team Lead, Linaro Platform Teams
Linaro.org | Open source software for ARM SoCs
Follow Linaro: http://www.
* Javier Martinez Canillas [120427 02:33]:
> On Wed, Apr 25, 2012 at 9:59 AM, Enric Balletbò i Serra
> wrote:
> >
> > Tony, as this is a fix ,may be included ?
> >
> > Acked-by: Enric Balletbo i Serra
> > Tested-by: Enric Balletbo i Serra
> >
> > Cheers,
> > Enric
>
> Hi Tony, Russel:
>
>
On Tue, 8 May 2012 21:48:14 +0530
Amit Daniel Kachhap wrote:
> This patch adds support for generic cpu thermal cooling low level
> implementations using frequency scaling up/down based on the registration
> parameters. Different cpu related cooling devices can be registered by the
> user and the
Hi Mr Kukjin,
Any comment or update about this patch?
Regards,
Amit Daniel
On Mon, Apr 30, 2012 at 10:13 PM, Rob Lee wrote:
> On Wed, Apr 25, 2012 at 9:44 AM, Daniel Lezcano
> wrote:
>> On 04/25/2012 02:11 PM, Amit Daniel Kachhap wrote:
>>>
>>> This patch enables core cpuidle timekeeping and i
On Tue, 8 May 2012 21:48:17 +0530
Amit Daniel Kachhap wrote:
> This code added creates a link between temperature sensors, linux thermal
> framework and cooling devices for samsung exynos platform. This layer
> monitors the temperature from the sensor and informs the generic thermal
> layer to t
On Tue, 8 May 2012 21:48:18 +0530
Amit Daniel Kachhap wrote:
> This patch adds necessary default platform data support needed for TMU driver.
> This dt/non-dt values are tested for origen exynos4210 and smdk exynos5250
> platforms.
>
>
> ...
>
> --- a/drivers/thermal/exynos_thermal.c
> +++ b/d
> Note that the Orion patches aren't here, but I figure that Andrew L.
> probably wants to check those against the final clk-next before I pull
> them.
Hi Mike
Here is a pull request. There is only one small change since the
previous version. The last patch no longer has
select COMMON_CLK_DISABL
On Tue, 8 May 2012 21:48:15 +0530
Amit Daniel Kachhap wrote:
> This movement is needed because the hwmon entries and corresponding
> sysfs interface is a duplicate of utilities already provided by
> driver/thermal/thermal_sys.c. The goal is to place it in thermal folder
> and add necessary funct
On Tue, 8 May 2012 21:48:12 +0530
Amit Daniel Kachhap wrote:
> This patchset introduces a new generic cooling device based on cpufreq that
> can be used on non-ACPI platforms. As a proof of concept, we have drivers for
> the following platforms using this mechanism now:
>
> * TI OMAP (git://gi
On 20120506-22:08, Mike Turquette wrote:
> Hi all,
>
> These five patches are hopefully the final set of core framework changes
> for 3.5. There is the obligatory MAINTAINERS file change, three new
> fixes and the fixed-factor clock patch. That last patch is being
> reposted since three bugs were
On Tue, 8 May 2012 16:30:05 +0300, Riku Voipio wrote:
> Hi,
>
> I think following any SD card brand for quality is a losing
> proposition. Every brand sources chips wherever they cheapest get, and
> thus what is inside the package changes from one batch to another.
> Everyone has anecdotal eviden
On 05/08/2012 10:44 PM, Kevin Hilman wrote:
Daniel Lezcano writes:
Define a CPU_IDLE section in the makefile, declare the functions in
the header files conforming to the kernel coding rules and remove the
'define's in the C files.
CONFIG_PM is enabled when CPU_IDLE is enabled because the cpui
Daniel Lezcano writes:
> On 05/04/2012 07:18 PM, Daniel Lezcano wrote:
>> Define a CPU_IDLE section in the makefile, declare the functions in
>> the header files conforming to the kernel coding rules and remove the
>> 'define's in the C files.
>>
>> CONFIG_PM is enabled when CPU_IDLE is enabled b
Daniel Lezcano writes:
> Define a CPU_IDLE section in the makefile, declare the functions in
> the header files conforming to the kernel coding rules and remove the
> 'define's in the C files.
>
> CONFIG_PM is enabled when CPU_IDLE is enabled because the cpuidle drivers
> use some functions from
On 05/04/2012 07:18 PM, Daniel Lezcano wrote:
Define a CPU_IDLE section in the makefile, declare the functions in
the header files conforming to the kernel coding rules and remove the
'define's in the C files.
CONFIG_PM is enabled when CPU_IDLE is enabled because the cpuidle drivers
use some fun
Hi, Amit,
Sorry for the late response as I'm in a travel recently.
I think the generic cpufreq cooling patches are good.
But about the THERMAL_TRIP_STATE_INSTANCE patch, what I'd like to see is that
1. from thermal zone point of view, when the temperature is higher than a trip
point, either AC
On Tue, May 8, 2012 at 9:12 AM, Shawn Guo wrote:
> On Sun, May 06, 2012 at 10:08:25PM -0700, Mike Turquette wrote:
>> If no one complains about these then I'll commit them to clk-next and
>> (finally) send my pull request to Arnd.
>>
> On mach-mxs:
>
> Tested-by: Shawn Guo
>
> Mike,
>
> I haven't
This movement is needed because the hwmon entries and corresponding
sysfs interface is a duplicate of utilities already provided by
driver/thermal/thermal_sys.c. The goal is to place it in thermal folder
and add necessary functions to use the in-kernel thermal interfaces.
Signed-off-by: Amit Danie
This patch adds support for generic cpu thermal cooling low level
implementations using frequency scaling up/down based on the registration
parameters. Different cpu related cooling devices can be registered by the
user and the binding of these cooling devices to the corresponding
trip points can b
Hi Andrew,
This patchset introduces a new generic cooling device based on cpufreq that
can be used on non-ACPI platforms. As a proof of concept, we have drivers for
the following platforms using this mechanism now:
* TI OMAP (git://git.linaro.org/people/amitdanielk/linux.git omap4460_thermal)
*
This code added creates a link between temperature sensors, linux thermal
framework and cooling devices for samsung exynos platform. This layer
monitors the temperature from the sensor and informs the generic thermal
layer to take the necessary cooling action.
Signed-off-by: Amit Daniel Kachhap
-
This patch adds necessary default platform data support needed for TMU driver.
This dt/non-dt values are tested for origen exynos4210 and smdk exynos5250
platforms.
Signed-off-by: Amit Daniel Kachhap
---
drivers/thermal/exynos_thermal.c | 107 +-
1 files cha
This patch adds a new trip type THERMAL_TRIP_STATE_INSTANCE. This
trip behaves same as THERMAL_TRIP_ACTIVE but also passes the cooling
device instance number. This helps the cooling device registered as
different instances to perform appropriate cooling action decision in
the set_cur_state call bac
This patch inserts exynos5 TMU sensor changes in the thermal driver.
Some exynos4 changes are made generic for exynos series.
Signed-off-by: SangWook Ju
Signed-off-by: Amit Daniel Kachhap
---
drivers/thermal/Kconfig |6 +-
drivers/thermal/exynos_thermal.c |
On Sun, May 06, 2012 at 10:08:25PM -0700, Mike Turquette wrote:
> If no one complains about these then I'll commit them to clk-next and
> (finally) send my pull request to Arnd.
>
On mach-mxs:
Tested-by: Shawn Guo
Mike,
I haven't seen too many outstanding comments on these patches, except
the
I think this is the most accurate observation. Still, I would love to be able
to source the community for a larger data set. Perhaps we could build a small
and simple application that anonymously "pings" our web service with the cards
CID register. While we have no way of tracing individual fail
On Tuesday 08 May 2012, James Tunnicliffe wrote:
>
> https://wiki.linaro.org/WorkingGroups/Kernel/Projects/FlashCardSurvey
> is being kept up to date, but at a glance has no reliability comments.
> I have 4 Transcend class 10 32GB cards that rocket along, but one has
> stopped letting me write ima
Hi,
I think following any SD card brand for quality is a losing
proposition. Every brand sources chips wherever they cheapest get, and
thus what is inside the package changes from one batch to another.
Everyone has anecdotal evidence of one brands memory cards failing
more often than another, but
Very interesting. I have had 2 sandisks fail and only one kingston fail.
The only one that has never given me any trouble is a patriot.
On 8 May 2012 04:09, James Tunnicliffe wrote:
> https://wiki.linaro.org/WorkingGroups/Kernel/Projects/FlashCardSurvey
> is being kept up to date, but at a glanc
https://wiki.linaro.org/WorkingGroups/Kernel/Projects/FlashCardSurvey
is being kept up to date, but at a glance has no reliability comments.
I have 4 Transcend class 10 32GB cards that rocket along, but one has
stopped letting me write images to it with linaro-media-create, so
full marks for speed,
Yep, we predominantly use SanDisk and avoid Kingston.
Dave Pigott
Validation Engineer
T: +44 1223 45 00 24 | M +44 7940 45 93 44
Linaro.org │ Open source software for ARM SoCs
Follow Linaro: Facebook | Twitter | Blog
On 8 May 2012, at 06:55, Paul Larson wrote:
> In the lab, we use the sandisk ex
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