[dpdk-dev] [PATCH V3 0/4] bonding: fixes and enhancements

2016-03-10 Thread Bruce Richardson
On Tue, Mar 01, 2016 at 09:31:58AM -0800, Eric Kinzie wrote: > These are bug fixes and some small enhancements to allow bonding > to work with external control (teamd). Please consider integrating > these into DPDK 2.2 > > Changes in v2: > - remove "bond: handle slaves with fewer queues than bondi

[dpdk-dev] [PATCH V3 0/4] bonding: fixes and enhancements

2016-03-01 Thread Eric Kinzie
These are bug fixes and some small enhancements to allow bonding to work with external control (teamd). Please consider integrating these into DPDK 2.2 Changes in v2: - remove "bond: handle slaves with fewer queues than bonding device" - remove "bond: per-slave intermediate rx ring" Changes in v3