Re: [dpdk-dev] [PATCH 0/2] add Tx prepare support for bonding device

Hi，all Any comments to these patches？ On 2021/4/23 17:46, Chengchang Tang wrote: > This patch set add Tx prepare for bonding device. > > Currently, the bonding driver has not implemented the callback of > rte_eth_tx_prepare function. Therefore, the TX prepare function of the > slave devices will

Re: [dpdk-dev] [PATCH 0/2] add Tx prepare support for bonding device

在 2021/4/30 14:26, Chengchang Tang 写道: Hi，all Any comments？ On 2021/4/23 17:46, Chengchang Tang wrote: This patch set add Tx prepare for bonding device. Currently, the bonding driver has not implemented the callback of rte_eth_tx_prepare function. Therefore, the TX prepare function of the s

Re: [dpdk-dev] [PATCH 0/2] add Tx prepare support for bonding device

Hi，all Any comments？ On 2021/4/23 17:46, Chengchang Tang wrote: > This patch set add Tx prepare for bonding device. > > Currently, the bonding driver has not implemented the callback of > rte_eth_tx_prepare function. Therefore, the TX prepare function of the > slave devices will never be invoked.

[dpdk-dev] [PATCH 0/2] add Tx prepare support for bonding device

This patch set add Tx prepare for bonding device. Currently, the bonding driver has not implemented the callback of rte_eth_tx_prepare function. Therefore, the TX prepare function of the slave devices will never be invoked. When hardware offloading such as CKSUM and TSO are enabled for some driver