Steve,
the answers to your queries are:
1) The relief generation is normal, you seem to be confused by the fact
that you have square pads on signal layers. On the Plane layer you do not
have a square pad, you have a round relief pad based upon the size of your
hole and the prescribed relief rules defined in design rules, manufacturing
tab, power plane connect style.
2) I am no expert on this issue but fairly recent discussions have told
us this. To correctly connect to only one split plane the hole must be
within a single plane outline boundary. If it crosses boundaries then it may
connect to both planes and DRC will not catch this and you cannot edit a
rule to make it catch it.
Brad Velander,
Lead PCB Designer,
Norsat International Inc.,
#300 - 4401 Still Creek Dr.,
Burnaby, B.C., V5C 6G9.
Tel. (604) 292-9089 direct
Fax (604) 292-9010
website www.norsat.com
> -----Original Message-----
> From: [EMAIL PROTECTED] [mailto:[EMAIL PROTECTED]]
> Sent: Thursday, July 12, 2001 8:58 AM
> To: Protel EDA Forum
> Subject: [PEDA] Thermal Reliefs to Internal Planes
>
>
> Hi,
>
> I'm completing my first board, in 99SE SP5, with connections
> to internal
> planes. I've noticed some questionable behavior and I'd like
> to confirm my
> experience is normal.
>
> 1.) Protel does not create acceptable thermal reliefs for
> square pads. The
> thermal relief looks exactly the same as I would expect for
> round pad.
>
> Is there a way to direct Protel to create a specific relief
> for specific
> pads? Do I need to make all my pads round?
>
> 2.) In a split plane design, any pad must be fully within
> the defined area
> of the plane. If a pad overlaps with an adjacent plane then
> Protel may
> connect to both planes.
>
> If this occurs will the DRC catch it or do I need to plan to
> be extra careful
> when inspecting the Gerbers? The on-line DRC doesn't appear
> to catch it. Is
> there a rule I can define?
>
>
> I appreciate any help.
>
>
> Steve Allen
> Project Engineer
> Manufacturing Services, Inc.
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