On 26 March 2013 23:23, Guenter Roeck <li...@roeck-us.net> wrote:
> On Tue, Mar 26, 2013 at 03:06:59PM +0800, Hongbo Zhang wrote:
>> Each of ST-Ericsson X500 chip set series consists of both ABX500 and DBX500
>> chips. This is ABX500 hwmon driver, where the abx500.c is a common layer for
>> all ABX500s, and the ab8500.c is specific for AB8500 chip. Under this 
>> designed
>> structure, other chip specific files can be added simply using the same 
>> common
>> layer abx500.c.
>>
>> Signed-off-by: Hongbo Zhang <hongbo.zh...@linaro.org>
>
> Looks good except ...
>
>> diff --git a/drivers/power/ab8500_bmdata.c b/drivers/power/ab8500_bmdata.c
>> index d9f1f25..05a1077 100644
>> --- a/drivers/power/ab8500_bmdata.c
>> +++ b/drivers/power/ab8500_bmdata.c
>> @@ -28,8 +28,10 @@ const struct abx500_res_to_temp 
>> ab8500_temp_tbl_a_thermistor[] = {
>>       {60, 13437},
>>       {65, 12500},
>>  };
>> +EXPORT_SYMBOL(ab8500_temp_tbl_a_thermistor);
>>
> Those exports should be in the previous patch where you start exporting the 
> symbols,
> not in this patch.
>
Sorry, This was really my carelessness, will update it.

> Thanks,
> Guenter
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