On Tue, Jun 09, 2026 at 03:52:59PM +0530, Gaurav Kohli wrote: > Unlike the CPU, the CDSP/Modem does not throttle its speed automatically > when it reaches high temperatures in kodiak. > > Set up CDSP cooling by throttling the cdsp when it reaches 100°C and > for modem when it reaches to 95°C. > > Remove inherited mdmss cooling-map nodes for Non Modem kodiak variant.
Why? If it is a GNSS-only MPSS, does it not provide any thermal mitigation mechanisms? Does ADSP provide those? WPSS? > > Signed-off-by: Gaurav Kohli <[email protected]> > --- > arch/arm64/boot/dts/qcom/kodiak.dtsi | 127 > ++++++++++++++++++++- > .../boot/dts/qcom/qcs6490-radxa-dragon-q6a.dts | 17 +++ So, you removed those for Radxa Q6A, but not forRB3 Gen2. Why? > .../dts/qcom/qcs6490-thundercomm-minipc-g1iot.dts | 17 +++ > .../boot/dts/qcom/qcs6490-thundercomm-rubikpi3.dts | 17 +++ > .../boot/dts/qcom/sc7280-herobrine-lte-sku.dtsi | 18 +++ > .../boot/dts/qcom/sc7280-herobrine-wifi-sku.dtsi | 16 +++ > 6 files changed, 208 insertions(+), 4 deletions(-) > > diff --git a/arch/arm64/boot/dts/qcom/kodiak.dtsi > b/arch/arm64/boot/dts/qcom/kodiak.dtsi > index fa540d8c2615..d345add2d8c8 100644 > --- a/arch/arm64/boot/dts/qcom/kodiak.dtsi > +++ b/arch/arm64/boot/dts/qcom/kodiak.dtsi > @@ -3427,6 +3427,9 @@ remoteproc_mpss: remoteproc@4080000 { > qcom,smem-states = <&modem_smp2p_out 0>; > qcom,smem-state-names = "stop"; > > + #cooling-cells = <3>; > + tmd-names = "pa", "modem"; > + > status = "disabled"; > > glink-edge { > @@ -4787,6 +4790,9 @@ remoteproc_cdsp: remoteproc@a300000 { > qcom,smem-states = <&cdsp_smp2p_out 0>; > qcom,smem-state-names = "stop"; > > + #cooling-cells = <2>; > + tmd-names = "cdsp_sw"; I'm going to review only this DT, the comments apply to the rest of them. So, we have two cases, CDSP and MPSS. Why does CDSP have only 2 cells? Just because tmd-names has only one name? What if we add another mitigation (which can be added in the firmware), do we suddenly have to change number of cells and all the cooling devices to reflect it? Finally. If I understand correctly, these mitigtion mechanisms are provided by the firmware. Firmware differs between the boards. Vendors (in theory) can change them. Why do we list these names here, in the SoC DT? > + > status = "disabled"; > > glink-edge { > + cooling-maps { > + map0 { > + trip = <&mdmss0_alert1>; > + cooling-device = <&remoteproc_mpss 0 0 > 2>; What does this mean? I assume that the first cell is one of the mechanisms. What is the difference between them? Do we really need to list them one by one here? What do other cells mean? Why are they 0 and 2 rather than THERMAL_NO_LIMIT? How does one come with those values? This should all be documented and explained somewhere. > + }; > + > + map1 { > + trip = <&mdmss0_alert1>; > + cooling-device = <&remoteproc_mpss 1 0 > 2>; > + }; > + }; > }; > -- With best wishes Dmitry
