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Find an phone/electronics repair shop
with an _infrared_ BGA rework station and an experienced tech to
operate it. I would not go with hot air, as it's almost impossible
to stay within the thermal profile of the chip when using hot air
and the components in a cellphone are far too small and delicate
for that method. Weigh your options wisely, as the number of times
you can get away with re-heating the chip is very limited. Each
try will use two of these valuable heating/cooling cycles, one to
pull the chip up, and then one to seat it back on the (hopefully
re-masked and re-balled) surface.
On 01/06/2014 12:26 PM, Udi Finkelstein wrote:
The N900, at least the ones I have, start falling apart
sooner-or-later due to GSM chip BGA solders getting loose
(like the red-ring-of-death on Xbox 360).
The symptom is a yellow banner saying that all Telephony
functions are disabled.
http://talk.maemo.org/showthread.php?t=66870
I have 2 phones that suffers from this. One I got from a
friend who couldn't get anyone to fix it (that was about 2
years ago, when the cause was still unknown. The shop claimed
he played with alternate firmware, he went to court and lost).
The other was mine, and it started about 3 months ago. I
partially fixed it by placing pieces of paper below the battery,
but the situation got worse and worse.
Also my USB socket is dead, which is another common N900
symptom, but is more easily fixable.
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