Dear community, I have already established a symmetric 3D mesh using Garnet internal links as Through-Silicon Vias (TSVs). However, my current interest lies in developing a 3D stacked mesh where a bus serves as the interlayer communication mechanism. Utilizing a bus for vertical communication, as opposed to point-to-point links, has the potential to enhance performance by reducing the number of hops in the vertical direction to just one. However, I am aware that higher traffic rates may lead to congestion within the system.
My question is whether I need to create and integrate a separate bus module into Garnet for achieving the 3D stacked mesh topology, or if I can achieve the desired functionality using the existing Garnet SimObjects. Thank you for your assistance. Kind regards, Ali
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