One thing I'd like to see is a drill hole, because at the moment I use
vias for those. It means I usually have to have a minimum plating, or
DRC will warn me, but drill holes rarely need plating.
On 15 March 2011 22:32, Martin Kupec <[1]martin.ku...@kupson.cz> wrote:
On Tue, Mar 15, 2011 at 03:55:58PM -0600, John Doty wrote:
>
> On Mar 15, 2011, at 3:35 PM, Martin Kupec wrote:
>
> > There will be a struct called "via".
> > It will contain a "hole" and pointers to attached object on
> > all affected layers.
>
> No. A "via" is only one kind of composite object. The list of kinds
of composite objects that might appear on a board is unbounded. There
isn't even a single kind of via in real life. Having an ad hoc
implementation of each such object is impractical and confusing.
>
> Well-designed software would avoid implementing such things as
special kludges, but would have a general facility for describing them.
Then, users could contribute to libraries of such descriptions, so we
would not be so dependent on developers to spoon feed us every detail.
Footprints are a particular case of this, but other kinds of composite
objects (subcircuits, antennas, delay lines, buried vias, fuses,
current sense resistors, printed inductors and capacitors, ...) could
also be in the library if the software properly distinguished between
primitive elements and composite objects.
Ok. You got the point. I don't see how to do it right now, but I
will
think of it.
We need at least "hole" element. And say which layers it goes
through.
But the rest can by "just footprint". The problem I see is that the
number of layers affected differs, so the footprint has to
accomodate
that.
Martin
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