On Tue, May 4, 2010 at 8:33 AM, George M. Gallant <ggallant...@verizon.net> wrote: > I recently designed a small board that contained multiple instances > of a devices that utilized copper on the bottom layer for heat > dissipation (not ground). I ended up using closed loop trace around > these large pads as a keep out fence. Is there a better way? Moving > the part requires manual synchronization.
In the device footprint I would make a keepout ring. Add four rectangular pads around the heatsink pad. Make them all the same pin number. (* jcl *) -- Closed Tools + Open Files != Open Hardware You can't create open hardware with closed EDA tools. twitter: http://twitter.com/jluciani blog: http://www.luciani.org _______________________________________________ geda-user mailing list geda-user@moria.seul.org http://www.seul.org/cgi-bin/mailman/listinfo/geda-user
