On Tue, 13 Apr 2010 22:44:30 +0200, Tamas Szabo wrote: > Anyway isn't it a problem that which pad is on the top of another one?
No. Composite footprints just work. In the end it is just copper to the gerber export. My most complicated is a footprint for MMIC HF apmplifiers with pads on both sides of the board and vias to provide sufficient heat drain: http://www.gedasymbols.org/user/kai_martin_knaak/footprints/specific/MINICIRCUITS_MMIC.fp ---<)kaimartin(>--- -- Kai-Martin Knaak tel: +49-511-762-2895 Universität Hannover, Inst. für Quantenoptik fax: +49-511-762-2211 Welfengarten 1, 30167 Hannover http://www.iqo.uni-hannover.de GPG key: http://pgp.mit.edu:11371/pks/lookup?search=Knaak+kmk&op=get _______________________________________________ geda-user mailing list [email protected] http://www.seul.org/cgi-bin/mailman/listinfo/geda-user
