Normally the specs (mm2, mOhms, screw and/or weldings)  of the GB  path is ensured by the type testing; the production ensures the reproduction of the type tested by internal production control or better, so what remains is to test for production ERRORS.

Assuming that no component specs in the GB can be changed (due to the above), the remaining test to do is to ensure the required GB path is there ... and if the impedance is low enough. That can be done by 100uA and by 25A.

That said, a mOhm contact whisker, bridging a production error may create a  GB path  at 50 mOhm or so may burn away at 25 A and not at 100 uA.

It's your risk analysis, due diligence, and type of equipment that decides for the applied current.

Gert Gremmen

and so the quality is ensured by those.

On 17-5-2019 21:08, Regan Arndt wrote:

Hello members,

I tried to search my EMC-PSTC archives (to no avail) regarding a debate of using either ground bond (let's assume 25A for this discussion) or ground continuity (resistance measured < 0.1 ohm for this discussion) testing _during production_.

Therefore, I would like to bring the topic up (again?) and get your professional opinion on these tests.

(Side note: Omnia has put out a brochure recently promoting the use of ground bond test in addition to ground continuity during production, but I am a little skeptical.)


I am a proponent for the ground continuity test during production for several reasons:

1.It’s safe to conduct, especially for production staff

2.Less harmful to the equipment

3.Intent is to verify the ground path is ‘secure’.

And I am an opponent to the ground bond test during production for several reasons:

1.Dangerous to conduct. Need astute production personnel that know what they are doing.

2.I consider this a type test and ‘somewhat’ damaging/stressful….(Yes, can be debated)…


Yes, the ground bond test is useful and a good indicator for determining the ampacity integrity of cables/connectors but, in my opinion, it should be reserved for type testing only.

_I feel that there is no reason to do the ground bond test during production if the manufacture controls their components in purchasing/design via an ECO process, etc., thus the ground continuity test is thereby sufficient_.

If one have no component control process, then, yes, GB is a good idea.


Note that IEC 61010-1 Annex F (Routine tests) also specifies the ground continuity test (and not a ground bond test)....... but also take note that it does say the value for current is not specified.

*/F.2 Protective earth/*

/A continuity test is made between the earth pin of the appliance inlet or the //MAINS //plug of plug-connected equipment, or the //PROTECTIVE CONDUCTOR TERMINAL //of //PERMANENTLY CONNECTED EQUIPMENT //on the one side, and all //ACCESSIBLE //conductive parts which are required by 6.5.2 to be connected to the //PROTECTIVE CONDUCTOR TERMINAL //on the other side./

/NOTE No value is specified for the test current./

/
/

Your reply is greatly appreciated.

Thanks in advance.

Regan Arndt

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