Even though I have used SMT parts in my personal projects Craig, I agree
with most of what you have said, and avoid them in projects aimed at kit
builders. I will take exception, however, with your last statement. We
are well past the point where every variety of IC is available in both
SMT and DIP format. Almost all new parts are available only in SMT, or
even dies, especially in the communications market. This is because the
designs are driven mainly by the wireless/cellular market where size is
paramount.
It should be noted also that performance generally suffers with leaded
parts in RF circuits. Parasitic strays in bypass caps, chokes, resistors
and other simple parts are far lower in SMT parts. This may not matter
much in HF gear, although even in HF gear it is often important to have
unconditional stability into the UHF range.
73,
Larry N8LP
www.telepostinc.com
Craig Rairdin wrote:
Surface-mount technology has been in practical use for a very long time and
hasn't yet supplanted leaded parts. I can imagine there could come a time
when it won't be financially practical to manufacture every variety of IC in
both SMT and DIP formats, I'm having a harder time imagining leadless
resistors and capacitors replacing their leaded counterparts.
Write back in ten years and we'll see how it turned out. :-)
Craig
NZ0R
K1 #1966
K2 #4941
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