Reviewed-by: Nate DeSimone <[email protected]>

-----Original Message-----
From: Kubacki, Michael A <[email protected]> 
Sent: Tuesday, November 12, 2019 8:38 PM
To: [email protected]
Cc: Bi, Dandan <[email protected]>; Chaganty, Rangasai V 
<[email protected]>; Dong, Eric <[email protected]>; Desimone, 
Nathaniel L <[email protected]>; Gao, Liming <[email protected]>
Subject: [edk2-platforms][PATCH V1 43/49] Platform/Intel/Readme.md Content 
update

Updates the advanced feature location referenced in Readme.md to 
edk2-platforms/Features/Intel.

Cc: Dandan Bi <[email protected]>
Cc: Sai Chaganty <[email protected]>
Cc: Eric Dong <[email protected]>
Cc: Nate DeSimone <[email protected]>
Cc: Liming Gao <[email protected]>
Signed-off-by: Michael Kubacki <[email protected]>
---
 Platform/Intel/Readme.md | 14 +++++++-------
 1 file changed, 7 insertions(+), 7 deletions(-)

diff --git a/Platform/Intel/Readme.md b/Platform/Intel/Readme.md index 
0f86978fee..02d9517d19 100644
--- a/Platform/Intel/Readme.md
+++ b/Platform/Intel/Readme.md
@@ -89,8 +89,7 @@ A UEFI firmware implementation using MinPlatformPkg is 
constructed using the fol  The board package follows the standard EDK II 
package structure with the following additional elements and guidelines:
 * Only code usable across more than one board at the root level.
 * Board-specific code in a directory. The directory name should match that of 
the board supported.
-* Features not essential to achieve stage 5 or earlier boots are maintained in 
a Features folder at the appropriate
-  level in the package hierarchy.
+* Features not essential to achieve stage 5 or earlier boots are maintained in 
edk2-platforms/Features/Intel.
 
 Shared resources in the package root directory can include interfaces 
described in header files, library instances,  firmware modules, binaries, etc. 
The UEFI firmware implementation is built using the process described below 
from the @@ -260,16 +259,17 @@ return back to the minimum platform caller.
 
 ### **Package Builds**
 
-In some cases, such as AdvancedFeaturePkg, a package may provide a set of 
functionality that is included in other
+In some cases, such as BoardModulePkg, a package may provide a set of 
+functionality that is included in other
 packages. To test the build of the whole package, the "build" command should 
be used following the instructions below.
 
 1. Execute edksetup.bat (Windows) or edksetup.sh (Linux).
 2. Verify the "WORKSPACE" environment variable is set to the edk2 directory in 
your workspace.
-3. Set the "PACKAGES_PATH" environment variable to include the 
edk2-platforms/Platform/Intel and edk2-platforms/Silicon/Intel
-   directories.
-   * Windows example: set 
PACKAGES_PATH=c:\Edk2Workspace\edk2-platforms\Platform\Intel;c:\Edk2Workspace\edk2-platforms\Silicon\Intel
+3. Set the "PACKAGES_PATH" environment variable to include the 
edk2-platforms/Platform/Intel, edk2-platforms/Silicon/Intel,
+   and edk2-platforms/Features/Intel directories.
+   * Windows example: set 
PACKAGES_PATH=c:\Edk2Workspace\edk2-platforms\Platform\Intel;
+     
+c:\Edk2Workspace\edk2-platforms\Silicon\Intel;c:\Edk2Workspace\edk2-pla
+tforms\Features\Intel
 4. Build the package by specifying the package DSC as the platform build 
target from the Platform/Intel or Silicon/Intel directory:
-   "build -p AdvancedFeaturePkg/AdvancedFeaturePkg.dsc"
+   "build -p BoardModulePkg/BoardModulePkg.dsc -a IA32 -a X64"
 
 
 ### **Firmware Image Flashing**
--
2.16.2.windows.1


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